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LNK362 PDF预览

LNK362

更新时间: 2024-01-09 05:44:58
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT 开关
页数 文件大小 规格书
16页 736K
描述
Energy Effi cient, Low Power Off-Line Switcher IC

LNK362 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.74
Is Samacsys:N模拟集成电路 - 其他类型:SWITCHING REGULATOR
峰值回流温度(摄氏度):NOT SPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

LNK362 数据手册

 浏览型号LNK362的Datasheet PDF文件第10页浏览型号LNK362的Datasheet PDF文件第11页浏览型号LNK362的Datasheet PDF文件第12页浏览型号LNK362的Datasheet PDF文件第13页浏览型号LNK362的Datasheet PDF文件第15页浏览型号LNK362的Datasheet PDF文件第16页 
LNK362-364  
DIP-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
MINIMUM  
1. Package dimensions conform to JEDEC specification  
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)  
package with .300 inch row spacing.  
-E-  
2. Controlling dimensions are inches. Millimeter sizes are  
shown in parentheses.  
3. Dimensions shown do not include mold flash or other  
protrusions. Mold flash or protrusions shall not exceed  
.006 (.15) on any side.  
.240 (6.10)  
.260 (6.60)  
4. Pin locations start with Pin 1, and continue counter-clock-  
wise to Pin 8 when viewed from the top. The notch and/or  
dimple are aids in locating Pin 1. Pin 6 is omitted.  
5. Minimum metal to metal spacing at the package body for  
the omitted lead location is .137 inch (3.48 mm).  
6. Lead width measured at package body.  
Pin 1  
-D-  
.367 (9.32)  
.387 (9.83)  
7. Lead spacing measured with the leads constrained to be  
perpendicular to plane T.  
.057 (1.45)  
.068 (1.73)  
(NOTE 6)  
.125 (3.18)  
.145 (3.68)  
.015 (.38)  
MINIMUM  
-T-  
SEATING  
PLANE  
.008 (.20)  
.015 (.38)  
.120 (3.05)  
.140 (3.56)  
.300 (7.62) BSC  
(NOTE 7)  
.300 (7.62)  
.390 (9.91)  
.100 (2.54) BSC  
.048 (1.22)  
.053 (1.35)  
P08B  
.014 (.36)  
.022 (.56)  
T E D S .010 (.25) M  
PI-2551-121504  
SMD-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
MINIMUM  
1. Controlling dimensions are  
inches. Millimeter sizes are  
shown in parentheses.  
-E-  
2. Dimensions shown do not  
include mold flash or other  
protrusions. Mold flash or  
protrusions shall not exceed  
.006 (.15) on any side.  
3. Pin locations start with Pin 1,  
and continue counter-clock-  
wise to Pin 8 when viewed  
from the top. Pin 6 is omitted.  
4. Minimum metal to metal  
spacing at the package body  
for the omitted lead location  
is .137 inch (3.48 mm).  
.372 (9.45)  
.388 (9.86)  
.240 (6.10)  
.260 (6.60)  
.420  
.010 (.25)  
E S  
.046 .060 .060 .046  
.080  
Pin 1  
Pin 1  
-D-  
.086  
.186  
.100 (2.54) (BSC)  
5. Lead width measured at  
package body.  
6. D and E are referenced  
datums on the package  
body.  
.286  
.367 (9.32)  
.387 (9.83)  
Solder Pad Dimensions  
.057 (1.45)  
.068 (1.73)  
(NOTE 5)  
.125 (3.18)  
.145 (3.68)  
.004 (.10)  
.032 (.81)  
.037 (.94)  
.048 (1.22)  
.053 (1.35)  
°
°
.009 (.23)  
0 - 8  
.036 (0.91)  
.044 (1.12)  
.004 (.10)  
.012 (.30)  
G08B  
PI-2546-121504  
C
12/05  
14  

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