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LNK353G PDF预览

LNK353G

更新时间: 2024-01-25 08:58:11
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT 开关
页数 文件大小 规格书
16页 856K
描述
Enhanced, Energy Efficient, Low Power Off-Line Switcher IC

LNK353G 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.65
其他特性:REQUIRES AN AC SUPPLY OF 85 TO 265V模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制技术:PULSE WIDTH MODULATIONJESD-30 代码:R-PDIP-T7
JESD-609代码:e0长度:9.575 mm
功能数量:1端子数量:7
最高工作温度:125 °C最低工作温度:-40 °C
最大输出电流:0.4 A封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified表面贴装:NO
切换器配置:SINGLE最大切换频率:214 kHz
温度等级:AUTOMOTIVE端子面层:TIN LEAD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

LNK353G 数据手册

 浏览型号LNK353G的Datasheet PDF文件第10页浏览型号LNK353G的Datasheet PDF文件第11页浏览型号LNK353G的Datasheet PDF文件第12页浏览型号LNK353G的Datasheet PDF文件第14页浏览型号LNK353G的Datasheet PDF文件第15页浏览型号LNK353G的Datasheet PDF文件第16页 
LNK353/354  
DIP-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
MINIMUM  
1. Package dimensions conform to JEDEC specification  
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)  
package with .300 inch row spacing.  
-E-  
2. Controlling dimensions are inches. Millimeter sizes are  
shown in parentheses.  
3. Dimensions shown do not include mold flash or other  
protrusions. Mold flash or protrusions shall not exceed  
.006 (.15) on any side.  
.240 (6.10)  
.260 (6.60)  
4. Pin locations start with Pin 1, and continue counter-clock-  
wise to Pin 8 when viewed from the top. The notch and/or  
dimple are aids in locating Pin 1. Pin 6 is omitted.  
5. Minimum metal to metal spacing at the package body for  
the omitted lead location is .137 inch (3.48 mm).  
6. Lead width measured at package body.  
Pin 1  
-D-  
.367 (9.32)  
.387 (9.83)  
7. Lead spacing measured with the leads constrained to be  
perpendicular to plane T.  
.057 (1.45)  
.068 (1.73)  
(NOTE 6)  
.125 (3.18)  
.145 (3.68)  
.015 (.38)  
MINIMUM  
-T-  
SEATING  
PLANE  
.008 (.20)  
.015 (.38)  
.120 (3.05)  
.140 (3.56)  
.300 (7.62) BSC  
(NOTE 7)  
.300 (7.62)  
.390 (9.91)  
.100 (2.54) BSC  
.048 (1.22)  
.053 (1.35)  
P08B  
.014 (.36)  
.022 (.56)  
T E D S .010 (.25) M  
PI-2551-121504  
SMD-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
MINIMUM  
1. Controlling dimensions are  
inches. Millimeter sizes are  
shown in parentheses.  
-E-  
2. Dimensions shown do not  
include mold flash or other  
protrusions. Mold flash or  
protrusions shall not exceed  
.006 (.15) on any side.  
3. Pin locations start with Pin 1,  
and continue counter-clock-  
wise to Pin 8 when viewed  
from the top. Pin 6 is omitted.  
4. Minimum metal to metal  
spacing at the package body  
for the omitted lead location  
is .137 inch (3.48 mm).  
.372 (9.45)  
.388 (9.86)  
.240 (6.10)  
.260 (6.60)  
.420  
.010 (.25)  
E S  
.046 .060 .060 .046  
.080  
Pin 1  
Pin 1  
-D-  
.086  
.186  
.100 (2.54) (BSC)  
5. Lead width measured at  
package body.  
6. D and E are referenced  
datums on the package  
body.  
.286  
.367 (9.32)  
.387 (9.83)  
Solder Pad Dimensions  
.057 (1.45)  
.068 (1.73)  
(NOTE 5)  
.125 (3.18)  
.145 (3.68)  
.004 (.10)  
.032 (.81)  
.037 (.94)  
.048 (1.22)  
.053 (1.35)  
°
°
.009 (.23)  
0 - 8  
.036 (0.91)  
.044 (1.12)  
.004 (.10)  
.012 (.30)  
G08B  
PI-2546-121504  
F
2/05 13  

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