LMH6574
ZHCSIM9E –NOVEMBER 2004–REVISED AUGUST 2018
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
MIN
MAX
13.2
130
UNIT
V
Supply Voltage (V+ − V−)
(3)
IOUT
mA
Signal & Logic Input Pin Voltage
Signal & Logic Input Pin Current
Maximum Junction Temperature
Storage Temperature
±(VS+0.6)
±20
V
mA
°C
°C
+150
−65
+150
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics ±5 V tables
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum output current (IOUT) is determined by the device power dissipation limitations (The junction temperature cannot be
allowed to exceed 150°C). See the Power Dissipation for more details. A short circuit condition should be limited to 5 seconds or less.
6.2 ESD Ratings
VALUE
±2000
±200
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2)
Machine model (MM)
V(ESD)
Electrostatic discharge(1)
V
(1) Human Body model, 1.5 kΩ in series with 100 pF. Machine model, 0 Ω In series with 200 pF.
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 2000-V HBM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
−40
6
NOM
MAX
85
UNIT
°C
Operating Temperature
Supply Voltage
12
V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics ±5 V tables
6.4 Thermal Information
D
THERMAL METRIC(1)
UNIT
14 PINS
130
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
RθJC(top)
40
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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