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LMH6570MAX/NOPB PDF预览

LMH6570MAX/NOPB

更新时间: 2024-02-17 20:53:07
品牌 Logo 应用领域
德州仪器 - TI 放大器光电二极管运算放大器复用器
页数 文件大小 规格书
29页 1389K
描述
具有 2:1 高速多路复用器的 500MHz 高速运算放大器 | D | 8 | -40 to 85

LMH6570MAX/NOPB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP, SOP8,.25针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:5.32模拟集成电路 - 其他类型:VIDEO MULTIPLEXER
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:4.9 mm湿度敏感等级:1
负电源电压最大值(Vsup):-6 V负电源电压最小值(Vsup):-3 V
标称负供电电压 (Vsup):-3.3 V正常位置:NC
信道数量:1功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C输出:COMMON OUTPUT
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:+-3.3/+-5 V认证状态:Not Qualified
座面最大高度:1.75 mm最大信号电流:0.02 A
子类别:Multiplexer or Switches最大供电电流 (Isup):16 mA
最大供电电压 (Vsup):6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.91 mmBase Number Matches:1

LMH6570MAX/NOPB 数据手册

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LMH6570  
SNCS104D APRIL 2005REVISED DECEMBER 2014  
www.ti.com  
6 Specifications  
6.1 Absolute Maximum Ratings(1)(2)  
MIN  
MAX  
13.2  
UNIT  
V
Supply Voltage (V+ V)  
(3)  
IOUT  
130  
mA  
V
Signal & Logic Input Pin Voltage  
Signal & Logic Input Pin Current  
Maximum Junction Temperature  
Storage Temperature  
±(VS + 0.6)  
±20  
mA  
°C  
+150  
+150  
235  
65  
°C  
Infrared or Convection (20 sec)  
Wave Soldering (10 sec)  
°C  
Soldering Information  
260  
°C  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical  
Characteristics tables.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) The maximum output current (IOUT) is determined by the device power dissipation limitations (The junction temperature cannot be  
allowed to exceed 150°C). See Power Dissipation for more details. A short circuit condition should be limited to 5 seconds or less.  
6.2 ESD Ratings  
VALUE  
±2000  
±200  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Machine model (MM)(2)  
Electrostatic  
discharge  
V(ESD)  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with  
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. Human  
body model, 1.5kin series with 100 pF.  
(2) Machine model, 0 In series with 200 pF  
6.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
40  
6
NOM  
MAX  
85  
UNIT  
°C  
Operating Temperature  
Supply Voltage  
12  
V
6.4 Thermal Information  
D
THERMAL METRIC(1)  
UNIT  
8 PINS  
150  
RθJA  
Junction-to-ambient thermal resistance  
°C/W  
RθJC(top)  
Junction-to-case (top) thermal resistance  
50  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
4
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Copyright © 2005–2014, Texas Instruments Incorporated  
Product Folder Links: LMH6570  
 

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