Electrical Characteristics for Bridged-Mode Operation (Notes 3, 11) (Continued)
The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.
Symbol
Parameter
Conditions
LM4868
Typical Limit
Units
(Limits)
(Note 12) (Note 13)
THD+N Total Harmonic Distortion+Noise 20Hz ≤ f ≤ 20kHz, AVD = 2
LM4868MTE, RL = 4Ω, PO = 2W
0.3
0.3
0.3
67
%
%
LM4868LQ, RL = 4Ω, PO = 2W
LM4868, RL = 8Ω, PO = 1W
VDD = 5V, VRIPPLE = 200 mVRMS, RL = 8Ω,
CB = 2.2µF
%
PSRR
Power Supply Rejection Ratio
dB
XTALK
SNR
Channel Separation
f = 1 kHz, CB = 2.2µF
80
97
dB
dB
Signal To Noise Ratio
VDD = 5V, PO = 1.1W, RL = 8Ω
Electrical Characteristics for Single-Ended Operation (Notes 3, 11)
The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.
Symbol
Parameter
Conditions
LM4868
Units
(Limits)
Typical
Limit
(Note 13)
50
(Note 12)
VOS
PO
Output Offset Voltage
Output Power
VIN = 0V
5
mV (max)
mW (min)
mW
THD = 0.5%, f = 1kHz, RL = 32Ω
THD+N = 1%, f = 1kHz, RL = 8Ω (Note
17)
85
75
180
THD+N = 1%, f = 1kHz, RL = 16Ω
THD+N = 1%, f = 1kHz, RL = 32Ω
THD+N = 10%, f = 1kHz, RL = 16Ω
THD+N = 10%, f = 1kHz, RL = 32Ω
THD = 0.05%, RL = 5kΩ
165
88
mW
mW
mW
mW
VP-P
%
208
114
1
VOUT
Output Voltage Swing
THD+N
Total Harmonic Distortion+Noise
AV = −1, PO = 75mW, 20 Hz ≤ f ≤ 20kHz,
RL = 32Ω
0.2
PSRR
Power Supply Rejection Ratio
CB = 2.2µF, VRIPPLE = 200mVRMS
f = 1kHz
,
52
dB
XTALK
SNR
Channel Separation
f = 1kHz, CB = 2.2µF
60
94
dB
dB
Signal To Noise Ratio
VDD = 5V, PO = 340mW, RL = 8Ω
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not guaranteed for parameters where
no limit is given. The typical value however, is a good indication of device performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
, θ , and the ambient temperature T . The maximum
A
JMAX JA
allowable power dissipation is P
= (T
− T )/θ . For the LM4868, T
= 150˚C. For the θ s for different packages, please see the Application
DMAX
JMAX
A
JA
JMAX
JA
Information section or the Absolute Maximum Ratings section.
Note 5: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 6: Machine model, 220pF–240pF discharged through all pins.
2
Note 7: The given θ is for an LM4868 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 2in area of 1oz printed circuit board copper.
JA
2
Note 8: The given θ is for an LM4868 packaged in an MXA20A with the Exposed-DAP soldered to an exposed 1in area of 1oz printed circuit board copper.
JA
Note 9: The given θ is for an LM4868 packaged in an MXA20A with the Exposed-DAP not soldered to printed circuit board copper.
JA
2
Note 10: The given θ is for an LM4868 packaged in an LQA24A with the Exposed-DAP soldered to an exposed 2in area of 1oz printed circuit board copper.
JA
Note 11: All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.
Note 12: Typicals are measured at 25˚C and represent the parametric norm.
Note 13: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test, or
statistical analysis.
Note 14: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
Note 15: Output power is measured at the device terminals.
Note 16: When driving 3Ω or 4Ω loads and operating on a 5V supply, the LM4868LQ and LM4868MTE must be mounted to a circuit board that has a minimum of
2
2.5in of exposed, uniterrupted copper area connected to the LLP or TSSOP package’s exposed DAP.
Note 17: See Application Information section ’Single-Ended Output Power Performance and Measurement Considerations’ for more information.
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