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LM336BD-2-5 PDF预览

LM336BD-2-5

更新时间： 2024-02-23 17:24:44
品牌 Logo 应用领域
德州仪器 - TI 电源电路参考电压源光电二极管
页数 文件大小 规格书
10页 223K
描述
2.5-V INTEGRATED REFERENCE CIRCUITS

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LM336BD-2-5 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：SOIC
包装说明：SOIC-8针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.19Is Samacsys：N
模拟集成电路 - 其他类型：TWO TERMINAL VOLTAGE REFERENCEJESD-30 代码：R-PDSO-G8
JESD-609代码：e4长度：4.9 mm
湿度敏感等级：1功能数量：1
输出次数：1端子数量：8
最高工作温度：70 °C最低工作温度：
最大输出电压：2.54 V最小输出电压：2.44 V
标称输出电压：2.49 V封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP8,.25
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1.58 mm子类别：Voltage References
表面贴装：YES技术：BIPOLAR
最大电压温度系数：34 ppm/ °C温度等级：COMMERCIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED微调/可调输出：YES
宽度：3.91 mmBase Number Matches：1

LM336BD-2-5 数据手册

 浏览型号LM336BD-2-5的Datasheet PDF文件第3页浏览型号LM336BD-2-5的Datasheet PDF文件第4页浏览型号LM336BD-2-5的Datasheet PDF文件第5页浏览型号LM336BD-2-5的Datasheet PDF文件第7页浏览型号LM336BD-2-5的Datasheet PDF文件第8页浏览型号LM336BD-2-5的Datasheet PDF文件第9页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
LM236D-2-5  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
8
75  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
LM236DR-2-5  
SOIC  
D
8
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
LM236LP-2-5  
LM336BD-2-5  
OBSOLETE  
ACTIVE  
TO-92  
SOIC  
LP  
D
3
8
None  
Call TI  
Call TI  
75  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
LM336BDR-2-5  
ACTIVE  
SOIC  
D
8
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
LM336BLP-2-5  
LM336BLPR-2-5  
LM336D-2-5  
ACTIVE  
ACTIVE  
ACTIVE  
TO-92  
TO-92  
SOIC  
LP  
LP  
D
3
3
8
1000  
2000  
75  
None  
None  
CU SNPB  
CU SNPB  
Level-NC-NC-NC  
Level-NC-NC-NC  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
LM336DR-2-5  
ACTIVE  
SOIC  
D
8
2500  
Pb-Free  
(RoHS)  
CU NIPDAU Level-2-260C-1 YEAR/  
Level-1-235C-UNLIM  
LM336LP-2-5  
ACTIVE  
ACTIVE  
TO-92  
TO-92  
LP  
LP  
3
3
1000  
2000  
None  
None  
CU SNPB  
CU SNPB  
Level-NC-NC-NC  
Level-NC-NC-NC  
LM336LPR-2-5  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
1...345678910

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