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LM336-2.5MDC PDF预览

LM336-2.5MDC

更新时间: 2024-02-03 04:08:11
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
11页 219K
描述
1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.49V, UUC, DIE

LM336-2.5MDC 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:DIE, WAFERReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.54模拟集成电路 - 其他类型:TWO TERMINAL VOLTAGE REFERENCE
JESD-30 代码:X-XUUC-N湿度敏感等级:1
功能数量:1输出次数:1
最高工作温度:70 °C最低工作温度:
最大输出电压:2.59 V最小输出电压:2.39 V
标称输出电压:2.49 V封装主体材料:UNSPECIFIED
封装代码:DIE封装等效代码:WAFER
封装形状:UNSPECIFIED封装形式:UNCASED CHIP
峰值回流温度(摄氏度):260认证状态:Not Qualified
子类别:Voltage References表面贴装:YES
技术:BIPOLAR温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:40微调/可调输出:YES
最大电压容差:4%Base Number Matches:1

LM336-2.5MDC 数据手册

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PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  

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