是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | DIP, DIP14,.3 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 8.74 | 模拟集成电路 - 其他类型: | RECTANGULAR |
JESD-30 代码: | R-PDIP-T14 | JESD-609代码: | e0 |
长度: | 19.18 mm | 功能数量: | 1 |
端子数量: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | DIP | 封装等效代码: | DIP14,.3 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 4.5/40 V |
认证状态: | Not Qualified | 座面最大高度: | 5.08 mm |
子类别: | Analog Waveform Generation Functions | 最大供电电流 (Isup): | 4.5 mA |
最大供电电压 (Vsup): | 40 V | 最小供电电压 (Vsup): | 4.5 V |
表面贴装: | NO | 技术: | BIPOLAR |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 7.62 mm |
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