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LM2903EYF-C PDF预览

LM2903EYF-C

更新时间: 2024-04-09 18:59:36
品牌 Logo 应用领域
罗姆 - ROHM /
页数 文件大小 规格书
24页 1884K
描述
LM2903EYF-C is high-gain and ground sense input comparator. This IC is monolithic IC integrated du

LM2903EYF-C 数据手册

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LM2903EYxxx-C  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
Supply Voltage  
VCC-VEE  
VID  
36  
V
V
V
Differential Input Voltage(Note 1)  
36  
Common-mode Input Voltage Range  
VICMR  
(VEE - 0.3) to (VEE + 36)  
Input Current  
II  
±10  
150  
mA  
°C  
Maximum Junction Temperature  
Storage Temperature Range  
Tjmax  
Tstg  
-55 to +150  
°C  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by  
increasing board size and copper area so as not to exceed the maximum junction temperature rating.  
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.  
The input pin voltage is set to VEE or more.  
Thermal Resistance(Note 2)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 4)  
2s2p(Note 5)  
SOP8  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 3)  
θJA  
197.4  
21  
109.8  
19  
°C/W  
°C/W  
ΨJT  
SOP-J8  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 3)  
θJA  
149.3  
18  
76.9  
11  
°C/W  
°C/W  
ΨJT  
MSOP8  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 3)  
θJA  
284.1  
21  
135.4  
11  
°C/W  
°C/W  
ΨJT  
(Note 2) Based on JESD51-2A(Still-Air).  
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside  
surface of the component package.  
(Note 4) Using a PCB board based on JESD51-3.  
(Note 5) Using a PCB board based on JESD51-7.  
Layer Number of  
Measurement Board  
Material  
Board Size  
Single  
FR-4  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Material  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
4 Layers  
FR-4  
Top  
Copper Pattern  
Bottom  
Copper Pattern  
74.2 mm x 74.2 mm  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
Recommended Operating Conditions  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Single Supply  
Operating Supply Voltage  
Dual Supply  
3.0  
±1.5  
-40  
-
-
36.0  
±18.0  
+150  
VCC  
V
Operating Temperature  
Topr  
+25  
°C  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GHG2G500010-1-2  
3/21  
18.Dec.2023 Rev.005  

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