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LF398MX/NOPB PDF预览

LF398MX/NOPB

更新时间: 2024-02-16 00:35:01
品牌 Logo 应用领域
德州仪器 - TI 放大器光电二极管采样保持电路
页数 文件大小 规格书
38页 3397K
描述
单片采样保持电路(10µs 采集,7mV 失调电压) | D | 14 | 0 to 70

LF398MX/NOPB 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:SOIC包装说明:SOP, SOP14,.25
针数:14Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.29最长采集时间:25 µs
标称采集时间:20 µs放大器类型:SAMPLE AND HOLD CIRCUIT
最大模拟输入电压:11.5 V最小模拟输入电压:-11.5 V
JESD-30 代码:R-PDSO-G14JESD-609代码:e3
长度:8.65 mm湿度敏感等级:1
负供电电压上限:-18 V标称负供电电压 (Vsup):-15 V
功能数量:1端子数量:14
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP14,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:+-15 V认证状态:Not Qualified
采样并保持/跟踪并保持:SAMPLE座面最大高度:1.75 mm
子类别:Sample and Hold Circuit最大压摆率:6.5 mA
供电电压上限:18 V标称供电电压 (Vsup):15 V
表面贴装:YES技术:BIPOLAR
温度等级:COMMERCIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:3.9 mm

LF398MX/NOPB 数据手册

 浏览型号LF398MX/NOPB的Datasheet PDF文件第1页浏览型号LF398MX/NOPB的Datasheet PDF文件第2页浏览型号LF398MX/NOPB的Datasheet PDF文件第3页浏览型号LF398MX/NOPB的Datasheet PDF文件第5页浏览型号LF398MX/NOPB的Datasheet PDF文件第6页浏览型号LF398MX/NOPB的Datasheet PDF文件第7页 
LF198-N, LF298, LF398-N  
LF198A-N, LF398A-N  
ZHCSIW2C JULY 2000REVISED OCTOBER 2018  
www.ti.com.cn  
6 Specifications  
6.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)(2)  
MIN  
MAX  
±18  
500  
125  
85  
UNIT  
V
Supply voltage  
(3)  
Power dissipation  
(Package limitation, see  
LF198-N, LF198A-N  
LF298  
)
mW  
°C  
°C  
°C  
V
–55  
–25  
0
Operating ambient temperature  
LF398-N, LF398A-N  
70  
Input voltage  
±18  
30  
(4)  
Logic-to-logic reference differential voltage (see  
Output short circuit duration  
)
7
V
Indefinite  
Hold capacitor short circuit duration  
10  
sec  
°C  
°C  
°C  
°C  
°C  
H package (soldering, 10 sec.)  
N package (soldering, 10 sec.)  
M package: vapor phase (60 sec.)  
Infrared (15 sec.)  
260  
260  
215  
220  
150  
Lead temperature  
Storage temperature, Tstg  
–65  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.  
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, RθJA, and the ambient temperature,  
TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX TA) / RθJA, or the number given in the Absolute  
Maximum Ratings, whichever is lower. The maximum junction temperature, TJMAX, for the LF198-N and LF198A-N is 150°C; for the  
LF298, 115°C; and for the LF398-N and LF398A-N, 100°C.  
(4) Although the differential voltage may not exceed the limits given, the common-mode voltage on the logic pins may be equal to the  
supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins must always be at least  
2 V below the positive supply and 3 V above the negative supply.  
6.2 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
NOM  
MAX  
UNIT  
Supply voltage  
±15  
V
LF198-N, LF198A-N  
Ambient temperature LF298  
LF398-N, LF398A-N  
–55  
–25  
0
125  
85  
TJ  
°C  
70  
6.3 Thermal Information  
LF398-N  
P (PDIP)  
8 PINS  
48.9  
LF298, LF398-N  
LFx98x  
THERMAL METRIC(1)  
D (SOIC)  
14 PINS  
80.6  
LMC (TO-99)  
UNIT  
8 PINS  
85(2)  
20  
RθJA  
RθJC(top)  
RθJB  
ψJT  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
37.3  
38.1  
26.2  
35.4  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
14.3  
5.8  
ψJB  
26.0  
35.1  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953.  
(2) Board mount in 400 LF/min air flow.  
4
Copyright © 2000–2018, Texas Instruments Incorporated  

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