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L08055R6DETTR PDF预览

L08055R6DETTR

更新时间： 2024-02-01 09:59:14
品牌 Logo 应用领域
京瓷/艾维克斯 - KYOCERA AVX 测试射频感应器电感器
页数 文件大小 规格书
10页 178K
描述
General Purpose Inductor, 0.0056uH, 8.929%, 1 Element, Ferrite-Core, SMD, CHIP, 0805

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L08055R6DETTR 技术参数

生命周期：ActiveReach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8504.50.80.00
风险等级：5.46型芯材料：FERRITE
直流电阻：0.1 Ω标称电感 (L)：0.0056 µH
电感器应用：RF INDUCTOR电感器类型：GENERAL PURPOSE INDUCTOR
JESD-609代码：e3功能数量：1
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C最大额定电流：1.5 A
自谐振频率：4600 MHz形状/尺寸说明：RECTANGULAR PACKAGE
屏蔽：NO特殊特征：INDUCTANCE TOLERANCE IS 0.5 NANO HENRY
表面贴装：YES端子面层：MATTE TIN
端子位置：DUAL ENDED端子形状：WRAPAROUND
测试频率：450 MHz容差：8.929%
Base Number Matches：1

L08055R6DETTR 数据手册

 浏览型号L08055R6DETTR的Datasheet PDF文件第4页浏览型号L08055R6DETTR的Datasheet PDF文件第5页浏览型号L08055R6DETTR的Datasheet PDF文件第6页浏览型号L08055R6DETTR的Datasheet PDF文件第7页浏览型号L08055R6DETTR的Datasheet PDF文件第8页浏览型号L08055R6DETTR的Datasheet PDF文件第9页 
®
Accu-L  
Application Notes  
HANDLING  
HAND SOLDERING & REWORK  
SMD chips should be handled with care to avoid damage or  
contamination from perspiration and skin oils. The use of  
plastic tipped tweezers or vacuum pick-ups is strongly  
recommended for individual components. Bulk handling  
should ensure that abrasion and mechanical shock are min-  
imized. For automatic equipment, taped and reeled product  
is the ideal medium for direct presentation to the placement  
machine.  
Hand soldering is permissible. Preheat of the PCB to 100°C  
is required. The most preferable technique is to use hot air  
soldering tools. Where a soldering iron is used, a tempera-  
ture controlled model not exceeding 30 watts should be  
used and set to not more than 260°C. Maximum allowed  
time at temperature is 1 minute. When hand soldering, the  
base side (white side) must be soldered to the board.  
COOLING  
CIRCUIT BOARD TYPE  
All flexible types of circuit boards may be used (e.g. FR-4,  
G-10) and also alumina.  
After soldering, the assembly should preferably be allowed to  
cool naturally. In the event of assisted cooling, similar condi-  
tions to those recommended for preheating should be used.  
2
For other circuit board materials, please consult factory.  
CLEANING RECOMMENDATIONS  
Care should be taken to ensure that the devices are thor-  
oughly cleaned of flux residues, especially the space beneath  
the device. Such residues may otherwise become conduc-  
tive and effectively offer a lossy bypass to the device. Various  
recommended cleaning conditions (which must be optimized  
for the flux system being used) are as follows:  
COMPONENT PAD DESIGN  
Component pads must be designed to achieve good joints  
and minimize component movement during soldering.  
Pad designs are given below for both wave and reflow  
soldering.  
The basis of these designs is:  
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-  
tone, water, and other standard  
a. Pad width equal to component width. It is permissible  
to decrease this to as low as 85% of component width  
but it is not advisable to go below this.  
PCB cleaning liquids.  
Ultrasonic conditions . . power – 20w/liter max.  
frequency – 20kHz to 45kHz.  
b. Pad overlap about 0.3mm.  
Temperature. . . . . . . . . 80°C maximum (if not otherwise  
limited by chosen solvent system).  
c. Pad extension about 0.3mm for reflow.  
Pad extension about 0.8mm for wave soldering.  
Time. . . . . . . . . . . . . . . 5 minutes max.  
REFLOW SOLDERING  
DIMENSIONS: millimeters (inches)  
STORAGE CONDITIONS  
Recommended storage conditions for Accu-L® prior to use  
are as follows:  
0201  
0402  
0603  
0805  
Accu-L®  
Accu-L®  
Accu-L®  
Accu-L®  
Temperature. . . . . . . . . 15°C to 35°C  
Humidity . . . . . . . . . . . ≤65%  
0.26  
(0.010)  
0.7  
0.6  
(0.024)  
(0.028)  
0.90  
(0.035)  
0.78  
(0.031)  
1.6  
(0.063)  
0.26  
Air Pressure . . . . . . . . . 860mbar to 1060mbar  
0.4  
(0.015)  
(0.010)  
2.3  
(0.091)  
0.50  
2.8  
1.4  
(0.020)  
(0.110) (0.055)  
0.26  
(0.010)  
0.6  
(0.024)  
0.90  
0.34  
(0.013)  
(0.035)  
0.7  
(0.028)  
0.7  
RECOMMENDED SOLDERING PROFILE  
For recommended soldering profile see page 29  
(0.028)  
0.8  
(0.031)  
1.5  
(0.059)  
PREHEAT & SOLDERING  
The rate of preheat in production should not exceed  
4°C/second. It is recommended not to exceed 2°C/second.  
Temperature differential from preheat to soldering should not  
exceed 150°C.  
For further specific application or process advice, please  
consult AVX.  
40  
1...78910

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