Reference only
Caution
2. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving
moving smoothly. This imposes greater force upon the chip during mounting, causing cracked chips. Also, the locating
claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.
The suction nozzle and the locating claw must be maintained, checked, and replaced periodically.
4-1. Reflow Soldering
[Standard Conditions for Reflow Soldering]
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes deformation
inside the components. In order to prevent mechanical damage
to the components, preheating is required for both the
components and the PCB. Preheating conditions are shown
in table 1. It is required to keep the temperature differential
between the solder and the components surface (ΔT) as small
as possible.
Reflow
Temperature (℃)
Soldering
Peak Temperature
Gradual
Cooling
220℃(200℃)
ΔＴ
190℃(170℃)
170℃(150℃)
150℃(130℃)
Preheating
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of tin
is used. Please confirm the solderability of tin plated
termination chips before use.
Time
60 to 120 seconds 30 to 60 seconds
Temperature
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT) between
the component and the solvent within the range shown in table 1.
Vapor Reflow
Temperature (℃)
Soldering
Gradual
Cooling
Peak Temperature
Table 1
ΔＴ
190℃(170℃)
170℃(150℃)
150℃(130℃)
Part Number
Temperature Differential
K□□55
ΔT≦130°C
Preheating
Recommended Conditions
Pb-Sn Solder
Time
60 to 120 seconds 20 seconds max.
Lead Free
Solder
Reflow
Vapor Reflow
230 to 240°C
Peak Temperature 230 to 250°C
240 to 260°C
Air or N2
[Allowable Reflow Soldering Temperature and Time]
280
Saturated vapor
of inactive solvent
Atmosphere
Air
Pb-Sn Solder: Sn-37Pb
270
260
250
Lead Free Solder: Sn-3.0Ag-0.5Cu
240
230
220
0
30
60
90
120
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. If solder paste is excessive, solder between a chip and a
metal terminal melts. This causes the chip to move and
come off.
4-2. If solder paste is too little, it causes a lack of adhesive
strength on the metal terminal and the capacitor comes off.
4-3. Please make sure that solder is smoothly applied higher
than 0.3mm and lower than the level of the bottom of the
chip.
0.3mm min.
In section
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks to the PCB.
4-2. Flow Soldering
1. Do not apply flow soldering.
4/19
EGKRC05
5秒后页面跳转
PCF8574资料解读：主要参数分析、引脚说明
AD637数据手册解读：主要特性、引脚及其功能解读、电气参数
ADUM1201资料手册解读：参数分析、引脚说明、应用分析
一文带你了解压敏电阻器在直流电路中的过压保护作用
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
