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KCM55L5C2J183JDL1# PDF预览

KCM55L5C2J183JDL1#

更新时间: 2023-09-03 20:27:20
品牌 Logo 应用领域
村田 - MURATA 医疗医疗器械
页数 文件大小 规格书
20页 1846K
描述
汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C]

KCM55L5C2J183JDL1# 数据手册

 浏览型号KCM55L5C2J183JDL1#的Datasheet PDF文件第3页浏览型号KCM55L5C2J183JDL1#的Datasheet PDF文件第4页浏览型号KCM55L5C2J183JDL1#的Datasheet PDF文件第5页浏览型号KCM55L5C2J183JDL1#的Datasheet PDF文件第7页浏览型号KCM55L5C2J183JDL1#的Datasheet PDF文件第8页浏览型号KCM55L5C2J183JDL1#的Datasheet PDF文件第9页 
Reference only  
Caution  
4-3. Correction of Soldered Portion  
1. For the shape of the soldering iron tip, refer to the figure  
on the right.  
2. Regarding the type of solder, use a wire diameter of  
φ0.5mm or less (rosin core wire solder).  
3. Apply the tip of the soldering iron against the lower end  
of the metal terminal.  
(1) In order to prevent cracking caused by sudden heating  
of the ceramic device, do not touch the ceramic base  
directly.  
(2) In order to prevent deviations and dislocating of the  
chip, do not touch the junction of the chip and the metal  
terminal, and the metal portion on the outside directly.  
4. The amount of solder for corrections by soldering iron,  
should be lower than the height of the lower side of the chip.  
Solder Amount  
In section  
5. Washing  
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken  
solder joints. Take note not to vibrate PCBs.  
6. Electrical Test on Printed Circuit Board  
1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after  
mounting on the printed circuit board.  
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can  
flex the PCB, resulting in cracked chips or open solder joints. Provide backup pins on the back side of the PCB  
to prevent warping or flexing. Install backup pins as close to the capacitor as possible.  
1-2. Avoid vibration of the board by shock when a test-probe contacts a printed circuit board.  
[Not Recommended]  
[Recommended]  
Peeling  
Backup Pin  
Test-probe  
Test-probe  
7. Printed Circuit Board Cropping  
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that causes bending  
or twisting the board.  
1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack. Cracked capacitors may cause  
deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor.  
[Bending]  
[Twisting]  
5/19  
EGKRC03C  

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