Datasheet > KBPC2506

KBPC2506

更新时间： 2024-09-23 12:09:31

品牌	Logo	应用领域
亞昕 - YEASHIN		二极管局域网
页数	文件大小	规格书
2页	373K
描述
VOLTAGE RANGE 50 to 1000 Volts CURRENT 25 Ampere

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KBPC2506 数据手册

DATA SHEET

SEMICONDUCTOR

KBPC25005 THRU KBPC2510

VOLTAGE RANGE 50 to 1000 Volts

CURRENT 25 Ampere

MB-35 Uniti:nch(mm)

FEATURES

‧ Low cost

‧ This series is UL recognized under component

index, file number E127707

‧ High forward surge current capability

‧ Low thermal resistance.

‧ High isolation voltage from case to lugs.

‧ High temperature soldering guaranteed:

260℃/10 second, at 5 lbs. (2.3kg) tension.

‧ High temperature soldering : 260^OC / 10 seconds at terminals

‧ Pb free product at available : 99% Sn above meet RoHS

environment substance directive request

MECHANICAL DATA

‧ Case: Matel case.

‧ Terminal: Plated 0.25" (6.35mm) lug.

‧ Polarity: Polarity symbols marked on case.

‧ Mounting: Thru hole for #10 screw, 20 in,- lbs. Torqute Max.

‧ Weight: 1.02 ounce, 29 grams

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

‧ Ratings at 25°C ambient temperature unless otherwise specified

‧ Single phase, half wave, 60Hz, resistive or inductive load.

‧ For capacitive load derate current by 20%

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SYMBOLS

UNIT

PARAMETER

25005 2501

2502

2504

2506

2508

2510

Maximum Repetitive Peak Reverse Voltage

Maximum RMS Voltage

VRRM

VRMS

VDC

100

200

400

600

800

1000

Volts

140

200

280

400

420

600

560

800

700

Maximum DC Blocking Voltage

100

1000

Maximum Average Forward Rectified Output

Current, at TC = 50_ (Note 1, 2)

I(AV)

IFSM

Amps

Peak Forward Surge Current

8.3ms single half sine - wave superimposed on

rated load (JEDEC method )

300

Rating for Fusing (t<8.3ms)

I2t

373

1.1

A2s

per bridge element at 12.5A

Volts

Maximum Instantaneous Forward Voltage Drop

TA = 25℃

TA =100℃

μA

Maximum DC Reverse Current at rate

DC blocking voltage per element

1.0

Isolation Voltage from case to lugs

Typical Thermal Resistance (Note 1,2)

Operating Temperature Range

Storage Temperature Range

VISO

2500

VAC

RθJC

2.0

℃/W

(-65 to +150)

℃

TSTG

1. Unit mounted on 5”X6”X4.9”(12.8cm X 15.2cm X 12.4cm)A1.finned Plate.

2. Bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfase for maximum heat

Transfer efficiency with# 10 screw.

http://www.yeashin.com

REV.02 20120305

中文翻译

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