是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | BGA, BGA165,11X15,40 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
最长访问时间: | 0.45 ns | 最大时钟频率 (fCLK): | 250 MHz |
I/O 类型: | SEPARATE | JESD-30 代码: | R-PBGA-B165 |
JESD-609代码: | e1 | 内存密度: | 75497472 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 18 |
湿度敏感等级: | 3 | 端子数量: | 165 |
字数: | 4194304 words | 字数代码: | 4000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 4MX18 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA165,11X15,40 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 1.5/1.8,1.8 V | 认证状态: | Not Qualified |
最小待机电流: | 1.7 V | 子类别: | SRAMs |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K7J641882M-EI30 | SAMSUNG |
获取价格 |
Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165 | |
K7J641882M-EI300 | SAMSUNG |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | |
K7J641882M-EI30T | SAMSUNG |
获取价格 |
Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165 | |
K7J641882M-FC16 | SAMSUNG |
获取价格 |
72Mb M-die DDRII SRAM Specification | |
K7J641882M-FC160 | SAMSUNG |
获取价格 |
DDR SRAM, 4MX18, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | |
K7J641882M-FC16T | SAMSUNG |
获取价格 |
Standard SRAM, 4MX18, 0.5ns, CMOS, PBGA165 | |
K7J641882M-FC20 | SAMSUNG |
获取价格 |
72Mb M-die DDRII SRAM Specification | |
K7J641882M-FC20T | SAMSUNG |
获取价格 |
Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165 | |
K7J641882M-FC25 | SAMSUNG |
获取价格 |
72Mb M-die DDRII SRAM Specification | |
K7J641882M-FC250 | SAMSUNG |
获取价格 |
DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 |