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K4E660812B-TC600 PDF预览

K4E660812B-TC600

更新时间: 2024-02-24 20:18:22
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
21页 416K
描述
EDO DRAM, 8MX8, 65ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32

K4E660812B-TC600 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2,
针数:32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.92Is Samacsys:N
访问模式:FAST PAGE WITH EDO最长访问时间:65 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESHJESD-30 代码:R-PDSO-G32
长度:20.95 mm内存密度:67108864 bit
内存集成电路类型:EDO DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:32字数:8388608 words
字数代码:8000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:8MX8封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):240
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm
Base Number Matches:1

K4E660812B-TC600 数据手册

 浏览型号K4E660812B-TC600的Datasheet PDF文件第1页浏览型号K4E660812B-TC600的Datasheet PDF文件第2页浏览型号K4E660812B-TC600的Datasheet PDF文件第3页浏览型号K4E660812B-TC600的Datasheet PDF文件第5页浏览型号K4E660812B-TC600的Datasheet PDF文件第6页浏览型号K4E660812B-TC600的Datasheet PDF文件第7页 
K4E660812B,K4E640812B  
CMOS DRAM  
DC AND OPERATING CHARACTERISTICS (Continued)  
Max  
Symbol  
Power  
Speed  
Units  
K4E660812B  
K4E640812B  
-45  
-50  
-60  
100  
90  
80  
130  
120  
110  
mA  
mA  
mA  
ICC1  
ICC2  
ICC3  
Don¢t care  
Normal  
L
2
2
2
2
mA  
mA  
Don¢t care  
-45  
-50  
-60  
100  
90  
80  
130  
120  
110  
mA  
mA  
mA  
Don¢t care  
Don¢t care  
-45  
-50  
-60  
110  
100  
90  
120  
110  
100  
mA  
mA  
mA  
ICC4  
ICC5  
ICC6  
Normal  
L
500  
300  
500  
300  
uA  
uA  
Don¢t care  
-45  
-50  
-60  
100  
90  
80  
130  
120  
110  
mA  
mA  
mA  
Don¢t care  
ICC7  
ICCS  
L
L
Don¢t care  
Don¢t care  
400  
400  
400  
400  
uA  
uA  
ICC1* : Operating Current (RAS and CAS, Address cycling @tRC=min.)  
ICC2 : Standby Current (RAS=CAS=W=VIH)  
ICC3* : RAS-only Refresh Current (CAS=VIH, RAS cycling @tRC=min.)  
ICC4* : Extended Data Out Mode Current (RAS=VIL, CAS, Address cycling @tHPC=min.)  
ICC5 : Standby Current (RAS=CAS=W=VCC-0.2V)  
ICC6* : CAS-Before-RAS Refresh Current (RAS and CAS cycling @tRC=min)  
ICC7 : Battery back-up current, Average power supply current, Battery back-up mode  
Input high voltage(VIH)=VCC-0.2V, Input low voltage(VIL)=0.2V, CAS=CAS-before-RAS cycling or 0.2V  
W, OE=VIH, Address=Don¢t care, DQ=Open, TRC=31.25us  
ICCS : Self Refresh Current  
RAS=CAS=0.2V, W=OE=A0 ~ A12(A11)=VCC-0.2V or 0.2V, DQ0 ~ DQ7=VCC-0.2V, 0.2V or Open  
*Note :  
ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.  
ICC is specified as an average current. In ICC1, ICC3 and ICC6, address can be changed maximum once while RAS=VIL. In ICC4,  
address can be changed maximum once within one EDO mode cycle time, tHPC.  

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