JST134V-800T
JieJie Microelectronics Co., Ltd.
FIG.1 Maximum power dissipation versus RMS
FIG.2: RMS on-state current versus case
on-state current
temperature
P(W)
IT(RMS)(A)
1.2
1.6
104℃
1.4
1.2
1
1
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
0
0.2
0.4
0.6
IT(RMS)(A)
0.8
1
1.2
0
25
50
75
100
125
TC(℃)
FIG.3: RMS on-state current versus ambient
temperature (printed circuit board FR4, copper
thickness: 35μm) (full cycle)
FIG.4: Surge peak on-state current
versus number of cycles
ITSM(A)
25
IT(RMS)(A)
0.9
Tc=25℃,tp=20ms,one cycle,sine
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
20
15
10
5
0
0
25
50
75
100
125
1.E+0
1.E+1
1.E+2
1.E+3
1.E+4
1.E+5
Ta(℃)
FIG.5: On-state characteristics
FIG.6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp<20ms, and corresponding value of I2t
SHNCDJDFKVFKPJDFGPSDJFPAJFJOFJOJS
OPGJOPRJGJOSDHSDHHHSEHUISHFSUIH
(Ⅰ-Ⅱ: dI/dt<30A/μs; Ⅲ-Ⅳ: dI/dt<20A/μs)
ITSM(A), I2t(A2s)
ITM(A)
Tj=25℃ typ
dI/dt(I/II)
Tj=25℃ max
10
100
10
1
ITSM
dI/dt(III/IV)
Tj=125℃ typ
1
I2t
0.1
0
0.5
1
1.5
VTM(V)
2
2.5
3
0.01
0.1
1
10
tp(ms)
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