Datasheet > JS28F800C3BD70

JS28F800C3BD70

更新时间： 2024-02-23 11:32:18

品牌	Logo	应用领域
英特尔 - INTEL		光电二极管内存集成电路闪存
页数	文件大小	规格书
72页	1083K
描述
Flash, 512KX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48

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技术参数
数据手册

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JS28F800C3BD70 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	TSOP
包装说明：	TSOP1,	针数：	48
Reach Compliance Code：	unknown	风险等级：	5.79
最长访问时间：	70 ns	其他特性：	USER-SELECTABLE 3V OR 12V VPP
JESD-30 代码：	R-PDSO-G48	JESD-609代码：	e3
长度：	18.4 mm	内存密度：	8388608 bit
内存集成电路类型：	FLASH	内存宽度：	16
功能数量：	1	端子数量：	48
字数：	524288 words	字数代码：	512000
工作模式：	ASYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：	-40 °C	组织：	512KX16
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSOP1
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE, THIN PROFILE
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	260
编程电压：	3 V	认证状态：	COMMERCIAL
座面最大高度：	1.2 mm	最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	2.7 V	标称供电电压 (Vsup)：	3 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子面层：	MATTE TIN	端子形式：	GULL WING
端子节距：	0.5 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	40	宽度：	12 mm
Base Number Matches：	1

JS28F800C3BD70 数据手册

Intel® Advanced+ Boot Block Flash Memory (C3)

Contents

1.0 Introduction....................................................................................................................................7

1.1

1.2

Nomenclature .......................................................................................................................7

Conventions..........................................................................................................................7

2.0 Functional Overview .....................................................................................................................8

2.1

2.2

2.3

Product Overview .................................................................................................................8

Block Diagram ......................................................................................................................9

Memory Map.........................................................................................................................9

3.0 Package Information ...................................................................................................................12

3.1

3.2

3.3

mBGA* and VF BGA Package............................................................................................12

TSOP Package...................................................................................................................13

Easy BGA Package ............................................................................................................14

4.0 Ballout and Signal Descriptions ................................................................................................15

4.1

4.2

4.3

48-Lead TSOP Package.....................................................................................................15

64-Ball Easy BGA Package................................................................................................18

Signal Descriptions .............................................................................................................18

5.0 Maximum Ratings and Operating Conditions...........................................................................20

5.1

5.2

Absolute Maximum Ratings................................................................................................20

Operating Conditions..........................................................................................................20

6.0 Electrical Specifications .............................................................................................................22

6.1

6.2

Current Characteristics.......................................................................................................22

DC Voltage Characteristics.................................................................................................24

7.0 AC Characteristics ......................................................................................................................25

7.1

7.2

7.3

7.4

7.5

AC Read Characteristics ....................................................................................................25

AC Write Characteristics.....................................................................................................29

Erase and Program Timings ...............................................................................................33

AC I/O Test Conditions.......................................................................................................33

Device Capacitance............................................................................................................34

8.0 Power and Reset Specifications ................................................................................................35

8.1

8.2

8.3

8.4

8.5

Active Power (Program/Erase/Read)..................................................................................35

Automatic Power Savings (APS) ........................................................................................35

Standby Power ...................................................................................................................35

Deep Power-Down Mode....................................................................................................35

Power and Reset Considerations .......................................................................................36

8.5.1 Power-Up/Down Characteristics............................................................................36

8.5.2 RP# Connected to System Reset ..........................................................................36

8.5.3 VCC, VPP and RP# Transitions ............................................................................36

8.5.4 Reset Specifications ..............................................................................................37

Power Supply Decoupling...................................................................................................37

8.6

9.0 Device Operations .......................................................................................................................39

Datasheet

Intel® Advanced+ Boot Block Flash Memory (C3)

Order Number: 290645, Revision: 023

May 2005

1 234 5 6 7...72

中文翻译

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与JS28F800C3BD70相关器件

型号	品牌	获取价格	描述	数据表
JS28F800C3TD70	INTEL	获取价格	Flash, 512KX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48
JS28F800C3TD70	NUMONYX	获取价格	Flash, 512KX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48
JS29F02G08AANB3	NUMONYX	获取价格	Flash, 256MX8, 18ns, PDSO48, LEAD FREE, PLASTIC, TSOP1-48
JS29F04G08AANB1	INTEL	获取价格	Flash, 512KX8, 20ns, PDSO48, LEAD FREE, TSOP-48
JS29F04G08BANB3	NUMONYX	获取价格	Flash, 512MX8, 18ns, PDSO48, LEAD FREE, PLASTIC, TSOP1-48
JS29F08G08CANB1	INTEL	获取价格	Flash, 1MX8, 20ns, PDSO48, LEAD FREE, TSOP-48
JS29F08G08CANB2	INTEL	获取价格	Flash, 512KX8, 20ns, PDSO48, LEAD FREE, TSOP-48
JS29F08G08FANB3	NUMONYX	获取价格	Flash, 1GX8, 18ns, PDSO48, LEAD FREE, PLASTIC, TSOP1-48
JS29F16G08FANB1	INTEL	获取价格	Flash, 2MX8, 20ns, PDSO48, LEAD FREE, TSOP-48
JS2-R	BEL	获取价格	Time-lag Fuse Series

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