12000W JRC-T Series
JieJie Microelectronics CO. , Ltd
RATINGS AND V-I CHARACTERISTICS CURVES (TA=25℃, unless otherwise noted)
FIG.1:V- I curve characteristics
(Uni-directional)
FIG.2:V- I curve characteristics
(Bi-directional)
I
I
IPP
IF
IT
V
V
VC
VBR
VR
VC VBR VR
IR
IR
IT
VF
IR
IT
VR VBR VC
IPP
IPP
FIG.3: Pulse waveform
FIG.4: Pulse derating curve
IPPM(%IRSM)
PPP derating in percentage(%)
100
150
tr = rise time to peak value
td = decay time to half value
tr=10μs
80
60
40
Peak value
100
50
0
Half value
20
0
td
t(ms)
2.0
TJ(℃)
75 100
0
1.0
3.0
4.0
0
25
50
125
150
175
SOLDERING PARAMETERS
Pb-Free assembly
(see figure at right)
+150℃
Reflow condition
Reflow Condition
tp
TP
TL
Critical Zone
TL to TP
Ramp-up
-Temperature Min (Ts(min)
)
Pre
tL
-Temperature Max(Ts(max)
)
+200℃
TS(max)
Heat
-Time (Min to Max) (ts)
60-180 secs.
Ramp-down
Preheat
ts
Average ramp up rate (Liquidus Temp
(TL)to peak)
TS(min)
25
3℃/sec. Max
time to peak temperatue
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
+217℃
Time
(t 25℃ to peak)
-Temperature(TL)(Liquidus)
Reflow
-Temperature(tL)
60-150 secs.
+260(+0/-5)℃
Flow/Wave Soldering(Solder Dipping)
Peak Temp (Tp)
Time within 5℃of actual Peak Temp (tp) 20-40secs.
Peak temperature
Dipping time
Soldering
265℃
10 sec.
1 time
Ramp-down Rate
6℃/sec. Max
8 min. Max
+260℃
Time 25℃to Peak Temp (TP)
Do not exceed
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