Datasheet > JRC-T24A

JRC-T24A

更新时间： 2023-12-06 19:52:47

品牌	Logo	应用领域
捷捷微 - JJM		二极管
页数	文件大小	规格书
5页	853K
描述
车规瞬态电压抑制二极管

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数据手册

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JRC-T24A 数据手册

12000W JRC-T Series

JieJie Microelectronics CO. , Ltd

RATINGS AND V-I CHARACTERISTICS CURVES (T_A=25℃, unless otherwise noted)

FIG.1:V- I curve characteristics

(Uni-directional)

FIG.2:V- I curve characteristics

(Bi-directional)

IPP

VBR

_VCVBR VR

VR _VBRVC

IPP

FIG.3: Pulse waveform

FIG.4: Pulse derating curve

IPPM(%IRSM)

PPP derating in percentage(%)

100

150

tr = rise time to peak value

td = decay time to half value

tr=10μs

Peak value

100

Half value

t(ms)

2.0

TJ(℃)

75 100

1.0

3.0

4.0

125

150

175

SOLDERING PARAMETERS

Pb-Free assembly

(see figure at right)

+150℃

Reflow condition

Reflow Condition

Critical Zone

TL to TP

Ramp-up

-Temperature Min (T_s(min)

)

Pre

t_L

-Temperature Max(T_s(max)

)

+200℃

TS(max)

Heat

-Time (Min to Max) (t_s)

60-180 secs.

Ramp-down

Preheat

Average ramp up rate (Liquidus Temp

(T_L)to peak)

TS(min)

3℃/sec. Max

time to peak temperatue

T_s(max)to T_L- Ramp-up Rate

3℃/sec. Max

+217℃

Time

(t 25℃ to peak)

-Temperature(T_L)(Liquidus)

Reflow

-Temperature(t_L)

60-150 secs.

+260(+0/-5)℃

Flow/Wave Soldering(Solder Dipping)

Peak Temp (T_p)

Time within 5℃of actual Peak Temp (t_p) 20-40secs.

Peak temperature

Dipping time

Soldering

265℃

10 sec.

1 time

Ramp-down Rate

6℃/sec. Max

8 min. Max

+260℃

Time 25℃to Peak Temp (T_P)

Do not exceed

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