IXBOD1...R(D)
IXBOD1 - 12RD... - 19RD (2 Elements)
Symbol Definitions
Ratings
Conditions
min. typ. max.
breakover voltage
VBO
VBO (TVJ) = VBO, 25°C [1 + KT (TVJ - 25°C)]
IXBOD 1 -12RD
1150 1200 1250
1250 1300 1350
1350 1400 1450
1450 1500 1550
1550 1600 1650
1650 1700 1750
1750 1800 1850
1850 1900 1950
V
IXBOD 1 -13RD
V
V
V
V
V
V
V
IXBOD 1 -14RD
IXBOD 1 -15RD
IXBOD 1 -16RD
IXBOD 1 -17RD
IXBOD 1 -18RD
IXBOD 1 -19RD
RMS current
IRMS
f = 50 Hz
pins soldered to printed circuit (conductor 0.035x2mm)
T
amb = 50°C
0.3
A
maximum average forward current
maximum pulsed source current
I2t value for fusing
IFAVM
ISM
I2t
0.2
50
A
A
tp = 0.1 ms; non repetitive
tp = 0.1 ms
T
amb = 50°C
amb = 50°C
TVJ = 125°C
T
0.125
27
A2s
V
forward voltage drop
VT
IT = 5 A
VT0
rT
17.5
3
V
Ω
threshold voltage
slope resistance
for power-loss calculation only
IXBOD1 - 20R... - 32R (3 Elements)
Symbol Definitions
Ratings
Conditions
min. typ. max.
breakover voltage
VBO
VBO (TVJ) = VBO, 25°C [1 + KT (TVJ - 25°C)]
IXBOD 1 -20R
1950 2000 2050
2050 2100 2150
2150 2200 2250
2250 2300 2350
2350 2400 2450
2450 2500 2550
2500 2600 2700
2700 2800 2900
2900 3000 3100
3100 3200 3300
V
V
V
V
V
V
V
V
V
V
IXBOD 1 -21R
IXBOD 1 -22R
IXBOD 1 -23R
IXBOD 1 -24R
IXBOD 1 -25R
IXBOD 1 -26R
IXBOD 1 -28R
IXBOD 1 -30R
IXBOD 1 -32R
RMS current
IRMS
f = 50 Hz
pins soldered to printed circuit (conductor 0.035x2mm)
T
amb = 50°C
1.4
A
maximum average forward current
maximum pulsed source current
I2t value for fusing
IFAVM
ISM
I2t
0.9
200
2
A
A
tp = 0.1 ms; non repetitive
tp = 0.1 ms
T
amb = 50°C
amb = 50°C
TVJ = 125°C
T
A2s
V
forward voltage drop
VT
IT = 5 A
5.1
VT0
rT
3.3
0.36
V
Ω
threshold voltage
slope resistance
for power-loss calculation only
IXYS reserves the right to change limits, test conditions and dimensions.
Data according ot IEC 60747 and per semiconductor unless otherwise specified
20210720a
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