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IT1-168S-SV PDF预览

IT1-168S-SV

更新时间: 2024-02-06 21:23:40
品牌 Logo 应用领域
广濑 - HRS 连接器
页数 文件大小 规格书
17页 1080K
描述
High Speed, Matched-Impedance, Parallel Board-to-board Connector System

IT1-168S-SV 数据手册

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NEW  
High Speed, Matched-Impedance, Parallel Board-to-board Connector System  
IT1 Series  
Receptacle (2 required)  
IT1 Series Outline  
High-speed matched-impedance parallel board-to-board  
connector designed for applications requiring board-to-  
board spacing with transmission speeds exceeding  
1GHz. The connection system has matched impedance  
of 50 ohm or can be customized. Contacts are on 0.5mm  
pitch.  
Transmission Module  
Connection Cross-Sectional Diagram  
Features  
1. Impedance Matching using a 4-Layer Board  
The innovative transmission module uses PC boards  
with a strip line design of transmission lines, providing  
matched impedance of 50 ohms, for standard product.  
Receptacle  
2. Supports Multiple Connectors per board  
Designed with a tolerance of +/- 0.2mm for both the X  
and Y-axis. The three-piece structure and the +/- 0.2mm  
tolerance allows 3 or more IT1’s to be mounted on a  
single board.  
2-Point contact  
4-Layer board  
(Impedance matching)  
3. Customized Board-to-Board Distance  
Board-to-board distance can be customized, from 16mm  
to 40mm.  
Transmission Module  
2-Point contact  
Receptacle  
Ground lines or additional traces can be added to  
support high level, high speed transmission or mixed  
power/signal applications.  
4. Signal to Ground Ratio  
The standard signal-to-ground ratio is 10:2, which makes  
reliable matching of the characteristic impedance of each  
transmission line. This ratio also can be customized.  
5. Contact Reliability  
Use of double contact points on each of the contacts  
assures highly reliable performance.  
Applications  
Routers, servers, base stations and other  
telecommunication equipment.  
2004.8  
1

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