是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | unknown | 风险等级: | 5.68 |
模拟集成电路 - 其他类型: | THREE TERMINAL VOLTAGE REFERENCE | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 4.9 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
输出次数: | 1 | 端子数量: | 8 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
最大输出电压: | 2.502 V | 最小输出电压: | 2.498 V |
标称输出电压: | 2.5 V | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 1.75 mm | 最大供电电压 (Vsup): | 16.5 V |
最小供电电压 (Vsup): | 3.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
最大电压温度系数: | 10 ppm/ °C | 温度等级: | AUTOMOTIVE |
端子面层: | MATTE TIN | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 微调/可调输出: | YES |
宽度: | 3.9 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
ISL21009DFB841Z | INTERSIL |
获取价格 |
High Voltage Input Precision, Low Noise FGA⑩ | |
ISL21009DFB841Z-TK | RENESAS |
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High Voltage Input Precision, Low Noise FGA™ Voltage References; SOIC8; Temp Ran | |
ISL21009DFB850Z | INTERSIL |
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Precision, Low Noise FGA⑩ Voltage References | |
ISL21009DFB850Z-TK | INTERSIL |
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Precision, Low Noise FGA⑩ Voltage References | |
ISL21009MEP | INTERSIL |
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High Voltage Input Precision, Low Noise FGA™ | |
ISL2100A | INTERSIL |
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100V, 2A Peak, High Frequency Half-Bridge Drivers | |
ISL2100A | RENESAS |
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100V, 2A Peak, High Frequency Half-Bridge Drivers | |
ISL2100AABZ | INTERSIL |
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100V, 2A Peak, High Frequency Half-Bridge Drivers | |
ISL2100AAR3Z | INTERSIL |
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100V, 2A Peak, High Frequency Half-Bridge Drivers | |
ISL2100AAR3Z | ROCHESTER |
获取价格 |
2 A HALF BRDG BASED MOSFET DRIVER, PDSO9, 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-229WEED3, |