Datasheet > ISD2575GI

ISD2575GI

更新时间： 2024-02-02 13:20:53

品牌	Logo	应用领域
华邦 - WINBOND		光电二极管商用集成电路
页数	文件大小	规格书
42页	372K
描述
Speech Synthesizer With RCDG, 79.7s, CMOS, PDSO28

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技术参数
数据手册

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ISD2575GI 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
Reach Compliance Code：	not_compliant	风险等级：	5.87
Is Samacsys：	N	商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码：	R-PDSO-G28	JESD-609代码：	e0
端子数量：	28	封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP	封装等效代码：	SOP28,.5
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
电源：	5 V	认证状态：	Not Qualified
最长读取时间：	79.7 s	子类别：	Audio Synthesizer ICs
最大压摆率：	30 mA	表面贴装：	YES
技术：	CMOS	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	Base Number Matches：	1

ISD2575GI 数据手册

ISD2560/75/90/120

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

7.2. Operational Modes ..................................................................................................................... 11

7.2.1. Operational Modes Description............................................................................................ 12

8. TIMING DIAGRAMS.......................................................................................................................... 16

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 19

9.1 Operating Conditions................................................................................................................... 20

10. ELECTRICAL CHARACTERISTICS............................................................................................... 21

10.1. Parameters For Packaged Parts .............................................................................................. 21

10.1.1. Typical Parameter Variation with Voltage and Temperature............................................. 24

10.2. Parameters For Die .................................................................................................................. 25

10.2.1. Typical Parameter Variation with Voltage and Temperature............................................. 28

10.3. Parameters For Push-Button Mode.......................................................................................... 29

11. TYPICAL APPLICATION CIRCUIT................................................................................................. 30

12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 35

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 36

12.3. 28-Lead 8x13.4MM Plastic Thin Small Outline Package (TSOP) Type 1................................ 37

12.4. ISD2560/75/95/120 Product Bonding Physical Layout (Die) ^[1]................................................ 38

14. VERSION HISTORY ....................................................................................................................... 41

- 4 -

1 2 345 6 7...42

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与ISD2575GI相关器件

型号	品牌	获取价格	描述	数据表
ISD2575P	WINBOND	获取价格	Speech Synthesizer With RCDG, 75s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
ISD2575PI	ETC	获取价格	Single-Chip Voice Record/Playback Devices 60-, 75-, 90-, and 120-Second Durations
ISD2575PRODUCTS	ETC	获取价格
ISD2575PY	WINBOND	获取价格	Speech Synthesizer With RCDG, 75s, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28
ISD2575S	ETC	获取价格	Solid-State Recorder
ISD2575SI	ETC	获取价格	Solid-State Recorder
ISD2575SY	WINBOND	获取价格	Speech Synthesizer With RCDG, 75s, CMOS, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28
ISD2575T	WINBOND	获取价格	Consumer IC
ISD2575TI	WINBOND	获取价格	Consumer IC
ISD2575X	WINBOND	获取价格	Speech Synthesizer With RCDG, 75s, CMOS, DIE-28

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