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ISD2575GI PDF预览

ISD2575GI

更新时间: 2024-01-04 18:08:32
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
42页 372K
描述
Speech Synthesizer With RCDG, 79.7s, CMOS, PDSO28

ISD2575GI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:not_compliant风险等级:5.87
Is Samacsys:N商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28JESD-609代码:e0
端子数量:28封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP28,.5
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
电源:5 V认证状态:Not Qualified
最长读取时间:79.7 s子类别:Audio Synthesizer ICs
最大压摆率:30 mA表面贴装:YES
技术:CMOS端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

ISD2575GI 数据手册

 浏览型号ISD2575GI的Datasheet PDF文件第36页浏览型号ISD2575GI的Datasheet PDF文件第37页浏览型号ISD2575GI的Datasheet PDF文件第38页浏览型号ISD2575GI的Datasheet PDF文件第39页浏览型号ISD2575GI的Datasheet PDF文件第40页浏览型号ISD2575GI的Datasheet PDF文件第41页 
ISD2560/75/90/120  
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond  
makes no representation or warranties with respect to the accuracy or completeness of the contents of this  
publication and reserves the right to discontinue or make changes to specifications and product descriptions at  
any time without notice. No license, whether express or implied, to any intellectual property or other right of  
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wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe  
property or environmental injury could occur.  
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration  
only and Winbond makes no representation or warranty that such applications shall be suitable for the use  
specified.  
ISD® and ChipCorder® are trademarks of Winbond Electronics Corporation.  
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as  
published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond.  
Information contained in this ISD® ChipCorder® data sheet supersedes all data for the ISD ChipCorder products  
published by ISD® prior to August, 1998.  
This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD® ChipCorder®  
product specifications. In the event any inconsistencies exist between the information in this and other product  
documentation, or in the event that other product documentation contains information in addition to the information  
in this, the information contained herein supersedes and governs such other information in its entirety.  
Copyright© 2003, Winbond Electronics Corporation. All rights reserved. ISD®
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Winbond. ChipCorder® is a trademark of Winbond. All other trademarks are properties of their respective  
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http://www.winbond.com.tw/  
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Please note that all data and specifications are subject to change without notice.  
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