Datasheet > ISD1760XYIR01

ISD1760XYIR01

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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数据手册

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ISD1760XYIR01 数据手册

ISD1700 SERIES

11 PACKAGING

11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC

H_D

Dimension in Inches Dimension in mm

Symbol

Max.

1.20

Min. Nom. Max. Min. Nom.

0.047

0.006

0.041

0.05

0.002

0.035

0.15

0.95

0.17

0.040

1.00

0.20

1.05

0.27

0.007 0.008 0.011

0.10

0.004

0.461

0.008

0.465 0.469

0.15

11.80

8.00

0.21

0.006

11.70

11.90

0.311 0.315 0.319

0.520 0.528 0.536

7.90

8.10

13.60

13.40

13.20

0.022

0.020 0.024 0.028

0.031

0.55

0.60

0.80

0.50

0.70

0.000

0.10

0.004

0.00

Publication Release Date: January 23, 2007

Revision 1.3-S2

- 19 -

1...16 17 181920 21 22...24

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