ISD1740XYIR

更新时间： 2024-01-31 04:40:25

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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ISD1740XYIR 技术参数

ISD1700 SERIES

> T_Deb

T_r

T_f

FWD

RDY

T_Deb

T_RD

T_Sc2

T_LS1or T_LS2

T_Sc1

LED

Figure 12.4: Forward Operation with No Sound Effect

T_r

ERASE

T_Deb

T_f

T_RD

RDY

)

GE2

T_LS4or T_SE4

3x(T_LS1or T_SE1

T_GE1or (T_E+ T_LS2or T_SE2)

T_Sc2

T_Sc1

LED

Sp+, Sp-

Note: If SEs are recorded, then Sp+/- will have output.

Figure 12.5: Global Erase Operation with or without Sound Effects

- 10 -

1...7 8 91011 12 13...24

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型号	品牌	描述	获取价格	数据表
ISD1740XYIR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1740XYR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1740XYR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1750	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD1750A	WINBOND	Multi-Message Single-Chip Voice Record&Playback Devices	获取价格
ISD1750E	WINBOND	Audio Synthesizer IC,	获取价格