Datasheet > ILCX20-JJ2F18-24.000MHZ

ILCX20-JJ2F18-24.000MHZ

更新时间： 2023-08-15 00:00:00

品牌	Logo	应用领域
ILSI		/
页数	文件大小	规格书
2页	644K
描述
Parallel - Fundamental Quartz Crystal, 24MHz Nom, SMD, 4 PIN

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ILCX20-JJ2F18-24.000MHZ 数据手册

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4 Pad Ceramic Crystal, 1.6 mm x 1.2 mm

ILCX20 Series

Pb Free Solder Reflow Profile:

Ts max to T_L(Ramp-up

Rate)

3ºC / second max

Preheat

Temperature min (Ts min)

Temperature typ (Ts typ)

Temperature max (Ts max)

Time (Ts)

150ºC

175ºC

200ºC

60 to180 seconds

Ramp-up Tate (T_Lto Tp

3ºC / second max

Time Maintained Above

Temperature (T_L)

Time (T_L)

217ºC

60 to 150 seconds

Peak Temperature (Tp)

Time within 5ºC to Peak

Temperature (Tp)

Ramp-down Rate

Tune 25ºC to Peak

Temperature

260ºC max for 10 seconds

20 to 40 seconds

6ºC / second max

8 minute max

Units are backward compatible with +240ºC reflow processes

Tape and Reel Information:

Quantity per

Reel

3000

8.0 ±0.3

4.0 ±0.2

3.5 ±0.2

9.0±1.0

60 / 80

180

Environmental Specifications:

Thermal Shock

MIL-STD-883, Method 1011, Condition A

MIL-STD-883, Method 1004

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 2007, Condition A

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Pb-Free / RoHS / Green Compliant

JESD22-B102-D Method 2 (Preconditioning E)

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

MIL-STD-202, Method 215

Moisture Resistance

Mechanical Shock

Mechanical Vibration

Resistance to Soldering Heat

Hazardous Substance

Solderability

Gross Leak

Fine Leak

Solvent Resistance

Typical Application:

Package Information:

MSL = 1

Termination = e4 (Au over Ni over W base metal).

Rlimit

XTAL

Marking:

Line 1: I-Date Code (yww)

Rev 08/14/17_C

Page 2 of 2

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●

www.ilsiamerica.com

Specifications subject to change without notice

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