4 Pad Ceramic Package, 5.5 mm x 11.9 mm
ILCX05 Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 2a
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
1000
24 +/-.3
12+/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
B
C
D
E
F
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Terminal Strength
Gross Leak
Fine Leak
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Solvent Resistance
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
e-mail@ilsiamerica.com • www.ilsiamerica.com
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
Specifications subject to change without notice
06/09_A
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