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IBM25EMPPC750LFBC4660 PDF预览

IBM25EMPPC750LFBC4660

更新时间: 2024-02-17 12:58:01
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟外围集成电路
页数 文件大小 规格书
50页 600K
描述
RISC Microprocessor, 32-Bit, 466MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360

IBM25EMPPC750LFBC4660 技术参数

生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:BGA,针数:360
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.16
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:100 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:NOJESD-30 代码:S-CBGA-B360
长度:25 mm低功率模式:YES
端子数量:360最高工作温度:105 °C
最低工作温度:-40 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY认证状态:Not Qualified
座面最大高度:3.2 mm速度:466 MHz
最大供电电压:2.1 V最小供电电压:2 V
标称供电电压:2 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:25 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

IBM25EMPPC750LFBC4660 数据手册

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© International Business Machines Corporation 1999  
Printed in the United States of America  
7/99  
All Rights Reserved  
The information contained in this document is subject to change without notice. The products described in this document  
are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to  
persons. The information contained in this document does not affect or change IBM’s product specifications or warranties.  
Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of  
IBM or third parties. All information contained in this document was obtained in specific environments, and is presented as  
illustration. The results obtained in other operating environments may vary.  
While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied  
upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made.  
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN “AS IS” BASIS. In no event will IBM be lia-  
ble for any damages arising directly or indirectly from any use of the information contained in this document.  
IBM Microelectronics Division  
1580 Route 52, Bldg. 504  
Hopewell Junction, NY  
12533-6531  
The IBM home page can be found at http://www.ibm.com  
The IBM Microelectronics Division home page can be found at http://www.chips.ibm.com  

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