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IBM043611TLAB-4N PDF预览

IBM043611TLAB-4N

更新时间: 2024-01-03 05:44:58
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟静态存储器内存集成电路
页数 文件大小 规格书
22页 319K
描述
Standard SRAM, 32KX36, 2.25ns, CMOS, PBGA119, BGA-119

IBM043611TLAB-4N 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Lifetime Buy零件包装代码:BGA
包装说明:BGA, BGA119,7X17,50针数:119
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
Is Samacsys:N最长访问时间:2.25 ns
最大时钟频率 (fCLK):232.55 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:1179648 bit
内存集成电路类型:STANDARD SRAM内存宽度:36
功能数量:1端子数量:119
字数:32768 words字数代码:32000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.5,3.3 V认证状态:Not Qualified
座面最大高度:2.41 mm最大待机电流:0.025 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.55 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

IBM043611TLAB-4N 数据手册

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IBM043611TLAB4M  
x 1612/10, 3.3VMMDM15DSU-021045122.  
IBM041811TLAB  
IBM043611TLAB  
Preliminary  
Features  
32K x 36 & 64K x 18 SRAM  
• 32K x 36 or 64K x 18 Organizations  
• 0.45 Micron CMOS Technology  
• Common I/O  
• Asynchronous Output Enable and Power Down  
Inputs  
• Synchronous Pipeline Mode of Operation with  
Self-Timed Late Write  
• Boundary Scan using limited set of JTAG 1149.1  
functions  
• Single Differential HSTL/GTL Clock  
• Single +3.3V Power Supply and Ground  
• HSTL/GTL Input and Output levels  
• Byte Write Capability & Global Write Enable  
• 7 x 17 Bump Ball Grid Array Package with  
SRAM EDEC Standard Pinout and Boundary  
SCAN Order  
• Registered Addresses, Write Enables, Synchro-  
nous Select, and Data Ins  
• Programmable Impedance Output Drivers  
• Registered Outputs  
Description  
The IBM043611TLAB and IBM041811TLAB 1Mb  
SRAMS are Synchronous Pipeline Mode, high-per-  
formance CMOS Static Random Access Memories  
that are versatile, have wide I/O, and achieve 4ns  
cycle times. Dual differential K clocks are used to ini-  
tiate the read/write operation, and all internal opera-  
tions are self-timed. At the rising edge of the K clock,  
all Addresses, Write-Enables, Sync Select, and  
Data Ins are registered internally. Data Outs are  
updated from output registers off the next rising  
edge of the K clock. An internal Write buffer allows  
write data to follow one cycle after addresses and  
controls. The chip is operated with a single +3.3V  
power supply and is compatible with HSTL/GTL I/O  
interfaces.  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
77H9965.T5  
10/98  
Page 1 of 22  

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