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I17210PYIR01 PDF预览

I17210PYIR01

更新时间: 2024-01-23 21:18:28
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 382K
描述
Speech Synthesizer With RCDG, 420s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

I17210PYIR01 技术参数

生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDIP-T28JESD-609代码:e3
长度:36.83 mm功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
认证状态:Not Qualified最长读取时间:420 s
座面最大高度:4.83 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:NO
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL宽度:15.24 mm
Base Number Matches:1

I17210PYIR01 数据手册

 浏览型号I17210PYIR01的Datasheet PDF文件第16页浏览型号I17210PYIR01的Datasheet PDF文件第17页浏览型号I17210PYIR01的Datasheet PDF文件第18页浏览型号I17210PYIR01的Datasheet PDF文件第20页浏览型号I17210PYIR01的Datasheet PDF文件第21页浏览型号I17210PYIR01的Datasheet PDF文件第22页 
ISD1700 SERIES  
11 PACKAGING  
11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC  
HD  
D
c
e
E
b
θ
A
1 A  
2
L
Y
A
L1  
Dimension in Inches Dimension in mm  
Symbol  
Max.  
1.20  
Min. Nom. Max. Min. Nom.  
0.047  
A
0.002  
0.035  
0.006  
0.041  
0.05  
1
0.15  
A
0.95  
0.17  
0.040  
1.00  
0.20  
A2  
1.05  
0.27  
0.007 0.008 0.011  
b
0.10  
0.004  
0.461  
0.008  
0.465 0.469  
0.15  
11.80  
8.00  
0.21  
11.90  
0.006  
c
11.70  
D
E
0.311 0.315 0.319  
0.520 0.528 0.536  
0.022  
8.10  
7.90  
13.60  
13.40  
13.20  
D
H
0.55  
0.60  
0.80  
e
L
0.50  
0.70  
0.020  
0.028  
0.024  
0.031  
1
L
0.000  
0
0.00  
0
0.10  
5
0.004  
5
Y
3
3
θ
Publication Release Date: January 23, 2007  
Revision 1.3-S2  
- 19 -  

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