HYG045P06LA1B
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (Tc=25°C Unless Otherwise Noted)
VDSS
VGSS
TJ
Drain-Source Voltage
-60
±20
V
V
Gate-Source Voltage
Maximum Junction Temperature
Storage Temperature Range
Drain Current-Continuous
175
°C
°C
A
TSTG
IS
-55 to 175
-160
Tc=25°C
Mounted on Large Heat Sink
Tc=25°C
Tc=25°C
Tc=100°C
Tc=25°C
Tc=100°C
-710
-160
-113
250
125
0.6
A
A
IDM
ID
Pulsed Drain Current *
Continuous Drain Current
A
W
PD
Maximum Power Dissipation
W
RJC
RJA
EAS
°C/W
°C/W
mJ
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient **
SinglePulsed-Avalanche Energy ***
62
L=0.3mH
817.6
Note:
*
**
Repetitive rating; pulse width limited by max junction temperature.
Surface mounted on FR-4 board.
***
Limited by TJmax , starting TJ=25°C, L = 0.3mH, VD=-48V, VGS=-10V.
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)
HYG045P06LA1
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
Static Characteristics
VGS=0V,IDS=-250uA
VDS=-60V, VGS=0V
BVDSS
Drain-Source Breakdown Voltage
-60
-
-
-
-1
V
-
uA
uA
V
IDSS
Drain-to-Source Leakage Current
TJ=125°C
-
-
-50
-2.5
±100
5
VDS=VGS, IDS=-250uA
VGS=±20V,VDS=0V
VGS=-10V,ID= -50A
VGS=-4.5V,ID= -45A
VGS(th)
IGSS
Gate Threshold Voltage
-1.0
-1.3
-
Gate-Source Leakage Current
-
-
-
nA
mΩ
mΩ
3.9
4.6
RDS(ON)*
Drain-Source On-state Resistance
6
Diode Characteristics
VSD*
trr
Diode Forward Voltage
ISD= -50A,VGS=0V
-
-
-
-0.75
32.1
29.8
-1.2
V
Reverse Recovery Time
Reverse Recovery Charge
-
-
ns
nC
ISD= -50A,dI/dt=100A/us
Qrr
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