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HY57V28820HCT-KI PDF预览

HY57V28820HCT-KI

更新时间: 2024-11-27 03:27:31
品牌 Logo 应用领域
海力士 - HYNIX 存储内存集成电路光电二极管动态存储器时钟
页数 文件大小 规格书
11页 175K
描述
4Banks x 4M x 8bits Synchronous DRAM

HY57V28820HCT-KI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP54,.46,32
针数:54Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.9Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G54长度:22.23 mm
内存密度:134217728 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:54
字数:16777216 words字数代码:16000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP54,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
认证状态:Not Qualified刷新周期:4096
座面最大高度:1.194 mm自我刷新:YES
连续突发长度:1,2,4,8,FP最大待机电流:0.001 A
子类别:DRAMs最大压摆率:0.22 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

HY57V28820HCT-KI 数据手册

 浏览型号HY57V28820HCT-KI的Datasheet PDF文件第2页浏览型号HY57V28820HCT-KI的Datasheet PDF文件第3页浏览型号HY57V28820HCT-KI的Datasheet PDF文件第4页浏览型号HY57V28820HCT-KI的Datasheet PDF文件第5页浏览型号HY57V28820HCT-KI的Datasheet PDF文件第6页浏览型号HY57V28820HCT-KI的Datasheet PDF文件第7页 
HY57V28820HC(L)T-I  
4Banks x 4M x 8bits Synchronous DRAM  
DESCRIPTION  
The Hynix HY57V28820HC(L)T is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the Mobile applica-  
tions which require low power consumption and extended temperature range. f HY57V28820HC(L)T is organized as  
4banks of 4,194,304x8.  
HY57V28820HC(L)T is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and  
outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very  
high bandwidth. All input and output voltage levels are compatible with LVTTL.  
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write  
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count  
sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate  
command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined  
design is not restricted by a `2N` rule.)  
FEATURES  
Single 3.3±0.3V power supply  
Auto refresh and self refresh  
All device pins are compatible with LVTTL interface  
4096 refresh cycles / 64ms  
JEDEC standard 400mil 54pin TSOP-II with 0.8mm  
of pin pitch  
Programmable Burst Length and Burst Type  
- 1, 2, 4, 8 or Full Page for Sequential Burst  
- 1, 2, 4 or 8 for Interleave Burst  
All inputs and outputs referenced to positive edge of  
system clock  
Data mask function by DQM  
Internal four banks operation  
Programmable CAS Latency ; 2, 3 Clocks  
ORDERING INFORMATION  
Part No.  
Clock Frequency  
Power  
Organization  
Interface  
Package  
HY57V28820HCT-6I  
HY57V28820HCT-KI  
HY57V28820HCT-HI  
HY57V28820HCT-8I  
HY57V28820HCT-PI  
HY57V28820HCT-SI  
HY57V28820HCLT-6I  
HY57V28820HCLT-KI  
HY57V28820HCLT-HI  
HY57V28820HCLT-8I  
HY57V28820HCLT-PI  
HY57V28820HCLT-SI  
166MHz  
133MHz  
133MHz  
125MHz  
100MHz  
100MHz  
166MHz  
133MHz  
133MHz  
125MHz  
100MHz  
100MHz  
Normal  
4Banks x 4Mbits  
x 8  
LVTTL  
400mil 54pin TSOP II  
Low power  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.1/Jan. 02  
1

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