V
(5)
CC
Functional Block Diagram
Pinout
CX2
CX1
REAR VIEW
GND (6)
6
5
4
3
2
1
RXD (3)
SD (4)
HSDL-3xxx
SHIELD
TRANSMITTER
TXD (2)
LEDA (1)
R1
V
CC
I/O Pins Configuration Table
Pin Symbol Description
Notes
Tied through external resistor, R1, to regulated V from 2.7 to 5.5 volts.
1
2
LED A
TXD
LED Anode
Transmitter Data Input. Logic High turns on the LED. If held high longer than ~ 50 µs, the LED is turned
Active High. off. TXD must be either driven high or low. Do NOT float the pin.
CC
3
4
RXD
SD
Receiver Data Output. Output is a low pulse response when a light pulse is seen.
Active Low.
Shutdown.
Complete shutdown TXD, RXD, and PIN diode.
Active High.
5
6
–
V
Supply Voltage
Ground
Regulated, 2.7 to 5.5 volts.
Connect to system ground.
CC
GND
SHIELD EMI Shield
Connect to system ground via a low inductance trace. For best performance,
do not connect to GND directly at the part.
Recommended Application Circuit Components
Marking Information
Component
Recommended Value
2.2 Ω ± 5%, 0.25 Watt, for 2.7 ≤ V ≤ 3.3 V operation
The HSDL-3000#007/017 is
marked “YYWW” on the shield
where ‘YY’ indicates the unit’s
manufacturing year, and ‘WW’
refers to the work week in which
the unit is tested.
R1
CC
2.7 Ω ± 5%, 0.25 Watt, for 3.0 ≤ V ≤ 3.6 V operation
6.8 Ω ± 5%, 0.25 Watt, for 4.5 ≤ V ≤ 5.5 V operation
CC
CC
[1]
CX1
0.47 µF ± 20%, X7R Ceramic
6.8 µF ± 20%, Tantalum
[2]
CX2
Notes:
1. CX1 must be placed within 0.7 cm of HSDL-3000 to obtain optimum noise immunity.
2. In environments with noisy power supplies, supply rejection can be enhanced by including
CX2 as shown in ”HSDL-3000 Functional Block Diagram“on page 2.
Caution: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage
from electrostatic discharge (ESD). It is advised that normal static precautions be taken during handling and
assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
2