Infrared Reflow Profile
300
t2 = 11.5 ± .5 MINS. (SOLDER JOINT)
T (MAX.) = 250 °C OR 235 °C (+5-0) °C
ANY PART OF COMPONENT BODY
250
200
150
100
50
t1 = 8 ± 1 MINS. (SOLDER JOINT)
185 °C
3.5 ± .5 MINS.
(SOLDER JOINT)
T > 120 °C FOR t
GREATER THAN 2.5 MINS.
(SOLDER JOINT)
dT/dt < 3 °C/SEC.
0
0
2
4
6
8
10
12
14
TIME (t)
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Symbol
Min.
0°
Max.
70°
5.5
Units
Conditions
TA
C
V
V
V
VCC
4.5
Logic High Transmitter Input Voltage V (TXD)
2.5
5.5
IH
Logic Low Transmitter Input Voltage V (TXD)
0.0
0.3
IL
Logic High Receiver Input Irradiance
(870 nm)
EIH
0.0036
500 mW/cm2 For in-band signals*
Logic Low Receiver Input Irradiance
EIL
0.3
µW/cm2 For in-band signals*
LED (Logic High) Current Pulse
Amplitude
ILEDA
250
10
mA
For one metre links with
daylight filters
Receiver Set-up Time
ms
For full sensitivity after
transmitting
Signal Rate
2.4
116
Kp/s
Ambient Light
See IrDA Serial Infrared
Physical Layer Link Speci-
fication, Appendix A for
ambient levels. See Rx
TH+ section at the end
of this data sheet also.
*Note: An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, the pulse
repetition rate, PRR, is defined as 2.4 Kp/s ≤ PRR ≤ 115.2 Kp/s and the pulse width, PW, is defined as 1.6 s ≤ PW ≤ (3/16)/PRR.
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