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HPM10

更新时间: 2024-10-03 01:16:15
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安森美 - ONSEMI /
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17页 143K
描述
Power Management IC

HPM10 数据手册

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HPM10  
Power Management IC for  
Hearing Aids  
Introduction  
HPM10 is a Power Management IC (PMIC) that provides a  
high−performance solution for rechargeable batteries in hearing aids  
and hearing implant devices. Responsible for generating the voltage  
needed by the hearing aid, it manages the charging algorithms such  
that the battery autonomy and the number of charging cycles are  
optimized. The rechargeable chemistries supported include  
silver−zinc (AgZn), and lithium−ion (Li−Ion). HPM10 also detects  
zinc−air (Zn−Air) and nickel−metal hydride (Ni−MH) batteries but  
doesn’t charge them.  
www.onsemi.com  
WLCSP29  
BARE DIE  
HPM10 includes a Charger Communication Interface (CCIF) to  
inform the hearing aid charger about the charging progress. Other  
battery information such as voltage levels, current levels, temperature,  
and different types of battery failures can also be communicated.  
HPM10 has the flexibility that allows easy integration into various  
types of hearing aids. It can be used without any connection to the  
main hearing aid digital signal processing (DSP), and manage the  
switch on and off operation, as well as the battery EOL control  
by−itself. Closer integration and communication with the main  
hearing aid DSP can also be obtained.  
CASE 567MK  
MARKING DIAGRAM  
AWLYYWW  
A
= Assembly Location  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
This document contains information on a product under development.  
ON Semiconductor reserves the right to change or discontinue this  
product without notice.  
This document, and the information contained herein, is CONFIDENTIAL AND  
PROPRIETARY and the property of Semiconductor Components Industries,  
LLC., dba ON Semiconductor. It shall not be used, published, disclosed or  
disseminated outside of the Company, in whole or in part, without the written  
permission of ON Semiconductor. Reverse engineering of any or all of the  
information contained herein is strictly prohibited.  
ORDERING INFORMATION  
Device  
HPM10W29A100G  
Package  
Shipping  
Bare Die  
5,000 / Tape  
& Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
E 2015, SCILLC. All Rights Reserved.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
October, 2015 − Rev. 0  
HPM10/D  

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