生命周期: | Transferred | 包装说明: | DIP, DIP16,.3 |
Reach Compliance Code: | compliant | 风险等级: | 5.7 |
JESD-30 代码: | R-XDIP-T16 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | CERAMIC | 封装代码: | DIP |
封装等效代码: | DIP16,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 电源: | 5 V |
子类别: | Other Logic ICs | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
HPL1-82C139-9+ | ETC | Address Decoder |
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|
HPL1-82C338-8 | RENESAS | IC,ADDRESS DECODER,CMOS,DIP,20PIN,CERAMIC |
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|
HPL1-82C338-9 | RENESAS | IC,ADDRESS DECODER,CMOS,DIP,20PIN,CERAMIC |
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|
HPL1-82C339-8 | ETC | Address Decoder |
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|
HPL1-82C339-9 | ETC | Address Decoder |
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|
HPL18PT | CHENMKO | HIGH EFFICIENCY SILICON RECTIFIER |
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