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HMC712 PDF预览

HMC712

更新时间: 2024-02-06 10:23:23
品牌 Logo 应用领域
HITTITE 衰减器
页数 文件大小 规格书
8页 316K
描述
GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR, 5 - 30 GHz

HMC712 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:DIE,
针数:0Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.67JESD-30 代码:R-XUUC-N
JESD-609代码:e4长度:1.414 mm
功能数量:1最高工作温度:85 °C
最低工作温度:-55 °C封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP峰值回流温度(摄氏度):NOT SPECIFIED
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:OTHER端子面层:Gold (Au)
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:1.204 mm
Base Number Matches:1

HMC712 数据手册

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HMC712  
v01.0709  
GaAs MMIC VOLTAGE-VARIABLE  
ATTENUATOR, 5 - 30 GHz  
1
Outline Drawing  
Die Packaging Information [1]  
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).  
2. TYPICAL BOND PAD IS .004” SQUARE.  
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO  
CENTER EXCEPT AS NOTED.  
Standard  
Alternate  
[2]  
GP-2 (Gel Pack)  
[1] Refer to the “Packaging Information” section for die  
packaging dimensions.  
4. BACKSIDE METALIZATION: GOLD  
5. BACKSIDE METAL IS GROUND  
[2] For alternate packaging information contact Hittite  
Microwave Corporation.  
6. BOND PAD METALIZATION: GOLD  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
1 - 25  

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