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HMC625BLP5ETR PDF预览

HMC625BLP5ETR

更新时间: 2024-01-24 05:16:24
品牌 Logo 应用领域
亚德诺 - ADI 电信电信集成电路
页数 文件大小 规格书
9页 675K
描述
0.5 dB LSB GaAs MMIC 6-Bit Digital Variable Gain Amplifier, DC - 5 GHz

HMC625BLP5ETR 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active包装说明:HVQCCN,
针数:32Reach Compliance Code:compliant
风险等级:5.66JESD-30 代码:S-PQCC-N32
JESD-609代码:e3长度:5 mm
湿度敏感等级:3功能数量:1
端子数量:32最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
座面最大高度:1 mm标称供电电压:5 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:5 mmBase Number Matches:1

HMC625BLP5ETR 数据手册

 浏览型号HMC625BLP5ETR的Datasheet PDF文件第3页浏览型号HMC625BLP5ETR的Datasheet PDF文件第4页浏览型号HMC625BLP5ETR的Datasheet PDF文件第5页浏览型号HMC625BLP5ETR的Datasheet PDF文件第7页浏览型号HMC625BLP5ETR的Datasheet PDF文件第8页浏览型号HMC625BLP5ETR的Datasheet PDF文件第9页 
HMC625BLP5E  
v02.0616  
0.5 dB LSB GaAs MMIC 6-BIT DIGITAL  
VARIABLE GAIN AMPLIFIER, DC - 5 GHz  
Outline Drawing  
NOTES:  
1. LEADFRAME MATERIAL: COPPER ALLOY  
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]  
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.  
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.  
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.  
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.  
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE  
SOLDERED TO PCB RF GROUND.  
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.  
Package Information  
Part Number  
Package Body Material  
Lead Finish  
MSL Rating  
MSL3 [1]  
Package Marking [2]  
H625B  
XXXX  
HMC625BLP5E  
RoHS-compliant Low Stress Injection Molded Plastic  
100% matte Sn  
[1] Max peak reflow temperature of 260 °C  
[2] 4-Digit lot number XXXX  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
6
Application Support: Phone: 1-800-ANALOG-D  

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