Datasheet > HMC553_09

HMC553_09

更新时间： 2022-11-07 17:00:43

品牌	Logo	应用领域
HITTITE		/
页数	文件大小	规格书
6页	212K
描述
GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz

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HMC553_09 数据手册

HMC553

v02.1007

GaAs MMIC FUNDAMENTAL

MIXER, 7 - 14 GHz

Absolute Maximum Ratings

RF / IF Input

+25 dBm

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

LO Drive

+25 dBm

150 °C

Channel Temperature

Continuous Pdiss (T = 85 °C)

(derate 4.09 mW/°C above 85 °C)

266 mW

Thermal Resistance

(channel to die bottom)

244 °C/W

Storage Temperature

Operating Temperature

ESD Sensitivity (HBM)

-65 to +150 °C

-55 to +85 °C

Class 1C

Outline Drawing

NOTES:

Die Packaging Information ^[1]

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. DIE THICKNESS IS .004”.

Standard

Alternate

3. TYPICAL BOND PAD IS .004” SQUARE.

WP-7 (Waffle Pack)

[2]

4. BOND PAD SPACING CENTER TO CENTER IS .006”.

5. BACKSIDE METALLIZATION: GOLD.

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

6. BOND PAD METALLIZATION: GOLD.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

7. BACKSIDE METAL IS GROUND.

8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

9. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)

COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT

DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED

WITHIN THIS RECTANGULAR AREA.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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