Datasheet > HMC447LC3_09

HMC447LC3_09

更新时间： 2022-11-07 16:40:14

品牌	Logo	应用领域
HITTITE		/
页数	文件大小	规格书
6页	231K
描述
SMT GaAs HBT MMIC DIVIDE-BY-4, 10 - 26 GHz

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HMC447LC3_09 数据手册

HMC447LC3

v03.1208

SMT GaAs HBT MMIC

DIVIDE-BY-4, 10 - 26 GHz

Evaluation PCB

List of Materials for Evaluation PCB 107928 ^[1]

The circuit board used in the ﬁnal application sho-

uld use RF circuit design techniques. Signal lines

should have 50 ohm impedance while the package

ground leads and backside ground paddle should

be connected directly to the ground plane similar

to that shown. A sufficient number of via holes

should be used to connect the top and bottom

ground planes. The evaluation circuit board shown

is available from Hittite upon request.

Item

Description

PCB Mount SRI K-Connector

PCB Mount SMA RF Connector

DC Pin

J3, J4

10pF Capacitor, 0402 Pkg.

100 pF Capacitor, 0402 Pkg.

10000 pF Capacitor, 0603 Pkg.

2.2 uF Tantalum Capacitor

HMC447LC3 Divide-by-4

107926 Eval Board

C2, C3

[2]

PCB

[1] Reference this number when ordering complete evaluation PCB

[2] Circuit Board Material: Rogers 4350

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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型号	品牌	描述	获取价格	数据表
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