5秒后页面跳转
HMC283 PDF预览

HMC283

更新时间: 2024-02-17 16:56:58
品牌 Logo 应用领域
HITTITE 射频和微波射频放大器微波放大器功率放大器
页数 文件大小 规格书
8页 285K
描述
GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz

HMC283 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:DIE OR CHIP
Reach Compliance Code:compliant风险等级:5.84
Is Samacsys:N特性阻抗:50 Ω
构造:COMPONENT增益:16 dB
最大输入功率 (CW):8 dBmJESD-609代码:e4
功能数量:1最大工作频率:40000 MHz
最小工作频率:17000 MHz最高工作温度:85 °C
最低工作温度:-55 °C封装等效代码:DIE OR CHIP
电源:3.5 V射频/微波设备类型:WIDE BAND LOW POWER
子类别:RF/Microwave Amplifiers最大压摆率:400 mA
技术:GAAS端子面层:Gold (Au)
Base Number Matches:1

HMC283 数据手册

 浏览型号HMC283的Datasheet PDF文件第2页浏览型号HMC283的Datasheet PDF文件第3页浏览型号HMC283的Datasheet PDF文件第4页浏览型号HMC283的Datasheet PDF文件第6页浏览型号HMC283的Datasheet PDF文件第7页浏览型号HMC283的Datasheet PDF文件第8页 
HMC283  
v02.0500  
MICROWAVE CORPORATION  
GaAs MMIC MEDIUM POWER  
AMPLIFIER, 17 - 40 GHz  
1
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs  
The die should be attached directly to the ground plane  
eutectically or with conductive epoxy (see HMC gen-  
eral Handling, Mounting, Bonding Note.)  
50 Ohm Microstrip transmission lines on 0.127 mm (5  
mil) thick alumina thin film substrates are recom-  
mended for bringing RF to and from the chip (Figure 1).  
If 0.254 mm (10 mil) thick alumina thin film substrates  
must be used, the die should be raised 0.150 mm (6  
mils) so that the surface of the die is coplanar with the  
surface of the substrate. One way to accomplish this is  
to attach the 0.102 mm (4 mil) thick die to a 0.150 mm  
(6 mil) thick molybdenum heat spreader (moly-tab)  
which is then attached to the ground plane (Figure 2).  
Microstrip substrates should be brought as close to the  
die as possible in order to minimize bond wire length.  
Typical die-to-substrate spacing is 0.076 mm (3 mils).  
Figure 3: Typical HMC283 Assembly  
Gold ribbon of 0.076 mm x 0.013 mm (3 mil x 0.5 mil) is recommended to minimize inductance on the RF ports.  
0.025 mm (1 mil) diameter ball or wedge bonds are acceptable for DC bias connections.  
RF bypass capacitors should be used on the Vdd & Vgg inputs. 100 pF single layer capacitors (mounted eutecti-  
cally or by conductive epoxy) placed no further than 0.762 mm (30 mils) from the chip are recommended. The  
photo in figure 3 shows a typical assembly for the HMC283 MMIC chip.  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order Online at www.hittite.com  
1 - 14  

与HMC283相关器件

型号 品牌 描述 获取价格 数据表
HMC283_07 HITTITE GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz

获取价格

HMC283_08 HITTITE GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz

获取价格

HMC283_10 HITTITE GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz

获取价格

HMC283LM1 HITTITE SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz

获取价格

HMC283LM1_01 HITTITE SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz

获取价格

HMC283LM1_06 HITTITE SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz

获取价格