Datasheet > HMC135_09

HMC135_09

更新时间： 2022-03-30 16:02:10

品牌	Logo	应用领域
HITTITE		/
页数	文件大小	规格书
6页	451K
描述
GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz

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HMC135_09 数据手册

HMC135

v04.0909

GaAs MMIC BI-PHASE

MODULATOR, 1.8 - 5.2 GHz

Outline Drawing

Die Packaging Information ^[1]

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. TYPICAL BOND PAD IS .004” SQUARE.

3. BOND PAD SPACING IS .006” CENTER TO CENTER.

4. BACKSIDE METALIZATION: GOLD.

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging ꢀnformation” section for die

packaging dimensions.

5. BACKSIDE METAL IS GROUND.

6. BOND PAD METALIZATION: GOLD.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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