Datasheet > HMC1049LP5E_18

HMC1049LP5E_18

更新时间： 2022-02-26 12:50:10

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
14页	332K
描述
Low Noise Amplifier

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HMC1049LP5E_18 数据手册

HMC1049LP5E

Data Sheet

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

DETAIL A

(JEDEC 95)

5.10

5.00 SQ

4.90

0.30

0.25

0.18

PIN 1

INDICATOR

INDIC ATOR AREA OPTIO

(SEE DETAIL A)

0.50

BSC

3.80

3.70 SQ

3.60

EXPOSED

PAD

0.45

0.40

0.35

0.20 MIN

TOP VIEW

BOTTOM VIEW

3.50 REF

0.90

0.85

0.80

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

0.05 MAX

0.02 NOM

COPLANARITY

0.08

SECTION OF THIS DATA SHEET.

SEATING

PLANE

0.20 REF

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4.

Figure 37. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm and 0.85 mm Package Height

(HCP-32-1)

Dimensions shown in millimeters

ORDERING GUIDE

Moisture Sensitivity

Ordering Package

Package Description Quantity Option

Model¹

Temperature Range Lead Finish

Level (MSL) Rating²

HMC1049LP5E

HMC1049LP5ETR

−40°C to +85°C

100% matte Sn MSL1

32-Lead LFCSP

32-Lead LFCSP,

7”Tape and Reel

HCP-32-1

500

EVAL01-HMC1049LP5

Evaluation Board

¹All models are RoHS Compliant Parts.

²MSL1 rating indicates a maximum peak reflow temperature of 260°C.

registered trademarks are the property of their respective owners.

D16798-0-5/18(B)

www.analog.com/HMC1049LP5E

Rev. B | Page 14 of 14

1...11 12 1314

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