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HMC-MDB277

更新时间： 2024-01-31 06:28:20

品牌	Logo	应用领域
HITTITE		射频和微波射频混频器微波混频器
页数	文件大小	规格书
4页	147K
描述
GaAs MMIC FUNDAMENTAL MIXER, 70 - 90 GHz

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技术参数
数据手册

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HMC-MDB277 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Transferred	Reach Compliance Code：	compliant
ECCN代码：	5A991.H	风险等级：	5.67
Is Samacsys：	N	特性阻抗：	50 Ω
构造：	COMPONENT	JESD-609代码：	e4
最大工作频率：	90000 MHz	最小工作频率：	70000 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	DOUBLE BALANCED	端子面层：	Gold (Au)
Base Number Matches：	1

HMC-MDB277 数据手册

HMC-MDB277

v01.0209

GaAs MMIC FUNDAMENTAL

MIXER, 70 - 90 GHz

Upconverter Conversion Loss

Note 1: Measured Performance Characteristics (T_OP= 25°C)

RF = 81 - 85 GHz

LO = 71 - 75 GHz

IF = 10 GHz

-2

-4

PLO = +14 dBm

PRF = -20 dBm

-6

-8

-10

-12

-14

Absolute Maximum Ratings

LO Drive

+20 dBm

Storage Temperature

Operating Temperature

-65 °C to 150 °C

-55 °C to 85 °C

LO FREQUENCY (GHz)

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

NOTES:

Die Packaging Information ^[1]

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. TYPICAL BOND PAD IS .004” SQUARE.

3. BACKSIDE METALLIZATION: GOLD.

4. BACKSIDE METAL IS GROUND.

Standard

Alternate

GP-2 (Gel Pack)

[2]

5. BOND PAD METALLIZATION: GOLD.

6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

7. OVERALL DIE SIZE .002”

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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