Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
LED Component
Lead Size
Plated Through
-Hole Diameter
Diagonal
Manual Solder
Lead size (typ.) 0.45 × 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 in)
Wave Soldering
105°C Max.
30 sec Max.
250°C Max.
3 sec Max.
Dipping
(0.018 × 0.018 in.) (0.025 in)
Pre-heat Temperature
Pre-heat Time
–
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
–
Peak Temperature
Dwell Time
260°C Max.
5 sec Max.
Lead size (typ.) 0.50 × 0.50 mm
0.707 mm
1.05 to 1.15 mm
(0.041 to 0.045 in)
(0.020 × 0.020 in.) (0.028 in)
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information
on soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
FLUXING
50
30
SOLDER: SN63; FLUX: RMA
PREHEAT
20 30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0
10
40
50
TIME – SECONDS
Figure 17. Recommended wave soldering profile.
60
70
80
90 100
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries%
Data subject to change% Copyright © 2±±.-2±13 Avago Technologies% All rights reserved% Obsoletes .9ꢀ9-42.3EN
AV±2-1±6ꢀEN - July 24, 2±13
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