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HI5860_08 PDF预览

HI5860_08

更新时间: 2024-02-16 06:47:06
品牌 Logo 应用领域
英特矽尔 - INTERSIL 转换器
页数 文件大小 规格书
12页 507K
描述
12-Bit, 130MSPS, High Speed D/A Converter

HI5860_08 数据手册

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HI5860  
®
Data Sheet  
February 6, 2008  
FN4654.7  
12-Bit, 130MSPS, High Speed D/A  
Converter  
Features  
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . .130MSPS  
• Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)  
• Integral Linearity Error (Typ) . . . . . . . . . . . . . . . ±0.5 LSB  
• Adjustable Full Scale Output Current. . . . . 2mA to 20mA  
• Internal 1.2V Bandgap Voltage Reference  
• Single Power Supply from +5V to +3V  
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per  
Second), high speed, low power, D/A converter which is  
implemented in an advanced CMOS process. Operating  
from a single +3V to +5V supply, the converter provides  
20mA of full scale output current and includes  
edge-triggered CMOS input data latches. Low glitch energy  
and excellent frequency domain performance are achieved  
using a segmented current source architecture.  
• Power-Down Mode  
This device complements the HI5x60 and HI5x28 family of high  
speed converters, which includes 8-, 10-, 12-, and 14-bit  
devices.  
• CMOS Compatible Inputs  
• Excellent Spurious Free Dynamic Range  
(76dBc, f = 50MSPS, f  
= 2.51MHz)  
S
OUT  
Pinout  
• Excellent Multitone Intermodulation Distortion  
• Pb-Free Available (RoHS Compliant)  
HI5860  
(28 LD SOIC, TSSOP)  
TOP VIEW  
Applications  
(MSB) D11  
1
2
3
4
5
6
7
8
9
CLK  
28  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
27 DV  
• Basestations (Cellular, WLL)  
• Medical/Test Instrumentation  
• Wireless Communications Systems  
• Direct Digital Frequency Synthesis  
• Signal Reconstruction  
DD  
26 DCOM  
25 ACOM  
24 AV  
DD  
23 COMP2  
22 IOUTA  
21 IOUTB  
• High Resolution Imaging Systems  
• Arbitrary Waveform Generators  
20  
ACOM  
D2 10  
D1 11  
19 COMP1  
18 FSADJ  
17 REFIO  
16 REFLO  
15 SLEEP  
(LSB) D0 12  
NC 13  
NC 14  
Ordering Information  
PART  
NUMBER  
PART MARKING  
TEMP. RANGE (°C)  
-40 to +85  
PACKAGE  
28 Ld TSSOP  
PKG. DWG. #  
M28.173  
CLOCK SPEED  
130MHz  
HI5860IA*  
HI5860 IA  
HI5860IB  
HI5860IBZ  
HI5860IB  
-40 to +85  
28 Ld SOIC  
M28.3  
M28.3  
130MHz  
HI5860IBZ*  
(Note)  
-40 to +85  
28 Ld SOIC (Pb-free)  
130MHz  
HI5860SOICEVAL1  
+25  
Evaluation Platform  
130MHz  
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.  
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%  
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.  
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J  
STD-020.  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2000, 2005, 2008. All Rights Reserved  
All other trademarks mentioned are the property of their respective owners.  

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