HI5860
®
Data Sheet
February 6, 2008
FN4654.7
12-Bit, 130MSPS, High Speed D/A
Converter
Features
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . .130MSPS
• Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)
• Integral Linearity Error (Typ) . . . . . . . . . . . . . . . ±0.5 LSB
• Adjustable Full Scale Output Current. . . . . 2mA to 20mA
• Internal 1.2V Bandgap Voltage Reference
• Single Power Supply from +5V to +3V
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture.
• Power-Down Mode
This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8-, 10-, 12-, and 14-bit
devices.
• CMOS Compatible Inputs
• Excellent Spurious Free Dynamic Range
(76dBc, f = 50MSPS, f
= 2.51MHz)
S
OUT
Pinout
• Excellent Multitone Intermodulation Distortion
• Pb-Free Available (RoHS Compliant)
HI5860
(28 LD SOIC, TSSOP)
TOP VIEW
Applications
(MSB) D11
1
2
3
4
5
6
7
8
9
CLK
28
D10
D9
D8
D7
D6
D5
D4
D3
27 DV
• Basestations (Cellular, WLL)
• Medical/Test Instrumentation
• Wireless Communications Systems
• Direct Digital Frequency Synthesis
• Signal Reconstruction
DD
26 DCOM
25 ACOM
24 AV
DD
23 COMP2
22 IOUTA
21 IOUTB
• High Resolution Imaging Systems
• Arbitrary Waveform Generators
20
ACOM
D2 10
D1 11
19 COMP1
18 FSADJ
17 REFIO
16 REFLO
15 SLEEP
(LSB) D0 12
NC 13
NC 14
Ordering Information
PART
NUMBER
PART MARKING
TEMP. RANGE (°C)
-40 to +85
PACKAGE
28 Ld TSSOP
PKG. DWG. #
M28.173
CLOCK SPEED
130MHz
HI5860IA*
HI5860 IA
HI5860IB
HI5860IBZ
HI5860IB
-40 to +85
28 Ld SOIC
M28.3
M28.3
130MHz
HI5860IBZ*
(Note)
-40 to +85
28 Ld SOIC (Pb-free)
130MHz
HI5860SOICEVAL1
+25
Evaluation Platform
130MHz
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1
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