Contents
1
Introduction.......................................................................................................................11
1.1
Terminology.........................................................................................................12
1.1.1 Processor Packaging Terminology.........................................................12
References..........................................................................................................13
1.2
2
Electrical Specifications....................................................................................................15
2.1
2.2
2.3
FSB and GTLREF ...............................................................................................15
Power and Ground Lands ...................................................................................15
Decoupling Guidelines ........................................................................................15
2.3.1 VCC Decoupling.....................................................................................16
2.3.2 FSB GTL+ Decoupling ...........................................................................16
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking....................................16
Voltage Identification...........................................................................................17
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................19
Reserved, Unused, and TESTHI Signals............................................................20
FSB Signal Groups..............................................................................................20
GTL+ Asynchronous Signals...............................................................................22
Test Access Port (TAP) Connection....................................................................23
FSB Frequency Select Signals (BSEL[2:0])........................................................23
Absolute Maximum and Minimum Ratings..........................................................23
Processor DC Specifications...............................................................................24
2.11.1 Processor DC Specifications..................................................................24
VCC Overshoot Specification..............................................................................30
2.12.1 Die Voltage Validation............................................................................30
GTL+ FSB Specifications....................................................................................31
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3
Package Mechanical Specifications.................................................................................33
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Package Mechanical Drawing.............................................................................33
Processor Component Keep-Out Zones .............................................................37
Package Loading Specifications .........................................................................37
Package Handling Guidelines .............................................................................37
Package Insertion Specifications ........................................................................38
Processor Mass Specification .............................................................................38
Processor Materials.............................................................................................38
Processor Markings.............................................................................................38
Processor Land Coordinates...............................................................................40
4
5
Land Listing and Signal Descriptions ...............................................................................41
4.1
4.2
Processor Land Assignments..............................................................................41
Alphabetical Signals Reference ..........................................................................62
Thermal Specifications and Design Considerations.........................................................71
5.1
5.2
Processor Thermal Specifications.......................................................................71
5.1.1 Thermal Specifications...........................................................................71
5.1.2 Thermal Metrology .................................................................................74
Processor Thermal Features...............................................................................74
5.2.1 Thermal Monitor .....................................................................................74
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