HGV6021/6022/6024
Pin Configuration
HGV6021
HGV6021
HGV6024
HGV6022
Figure 1. Pin Assignment Diagram
Absolute Maximum Ratings
Condition
Power Supply Voltage (VDD to Vss)
Analog Input Voltage (IN+ or IN-)
PDB Input Voltage
Min
Max
-0.5V
+7.5V
V
+0.5V
Vss-0.5V
Vss-0.5V
-40°C
DD
+7V
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10sec)
Package Thermal Resistance (TA=+25℃)
SOP-8, θJA
+85 °C
+160°C
+245°C
-55°C
+150°C
125°C/W
216°C/W
190°C/W
190°C/W
333°C/W
MSOP-8, θJA
SOT-23-5, θJA
SOT23-6, θJA
SC70-5, θJA
ESD Susceptibility
HBM
8KV
MM
400V
Note:
Stress greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is
astress rating only and functional operation of the device at these or any other conditions outside those indicated in the
operationalsections of this specification are not implied. Exposure to absolute maximum rating conditions for extended
periods may affectreliability.
http://www.hgsemi.com.cn
2015 MAR
3 / 15